Semiconductor devices in SiC using vias through N-type substrate for backside contact to P-type layer
First Claim
1. A semiconductor device comprising:
- an N-type Silicon Carbide substrate;
an epitaxial structure on a first side of the N-type Silicon Carbide substrate, the epitaxial structure comprising a P-type Silicon Carbide layer adjacent to the N-type Silicon Carbide substrate;
a plurality of spaced apart highly doped regions formed in the P-type Silicon Carbide layer;
one or more openings through the N-type Silicon Carbide substrate corresponding to the plurality of spaced apart highly doped regions the that extend from a second side of the N-type Silicon Carbide substrate to the P-type Silicon Carbide layer in the epitaxial structure, the second side of the N-type Silicon Carbide substrate being opposite the first side of the N-type Silicon Carbide substrate;
a first contact on the epitaxial structure opposite the N-type Silicon Carbide substrate; and
a second contact on the second side of the N-type Silicon Carbide substrate and within the one or more openings through the N-type Silicon Carbide substrate such that the second contact is in physical and electrical contact with the P-type Silicon Carbide layer;
wherein, in a forward conduction state of the semiconductor device, current flows between the first contact and the second contact through the epitaxial structure.
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Accused Products
Abstract
A Silicon Carbide (SiC) semiconductor device having back-side contacts to a P-type region and methods of fabrication thereof are disclosed. In one embodiment, an SiC semiconductor device includes an N-type substrate and an epitaxial structure on a front-side of the N-type substrate. The epitaxial substrate includes a P-type layer adjacent to the N-type substrate and one or more additional SiC layers on the P-type layer opposite the N-type substrate. The semiconductor device also includes one or more openings through the N-type substrate that extend from a back-side of the N-type substrate to the P-type layer and a back-side contact on the back-side of the N-type substrate and within the one or more openings such that the back-side contact is in physical and electrical contact with the P-type layer. The semiconductor device further includes front-side contacts on the epitaxial structure opposite the N-type substrate.
3 Citations
25 Claims
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1. A semiconductor device comprising:
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an N-type Silicon Carbide substrate; an epitaxial structure on a first side of the N-type Silicon Carbide substrate, the epitaxial structure comprising a P-type Silicon Carbide layer adjacent to the N-type Silicon Carbide substrate; a plurality of spaced apart highly doped regions formed in the P-type Silicon Carbide layer; one or more openings through the N-type Silicon Carbide substrate corresponding to the plurality of spaced apart highly doped regions the that extend from a second side of the N-type Silicon Carbide substrate to the P-type Silicon Carbide layer in the epitaxial structure, the second side of the N-type Silicon Carbide substrate being opposite the first side of the N-type Silicon Carbide substrate; a first contact on the epitaxial structure opposite the N-type Silicon Carbide substrate; and a second contact on the second side of the N-type Silicon Carbide substrate and within the one or more openings through the N-type Silicon Carbide substrate such that the second contact is in physical and electrical contact with the P-type Silicon Carbide layer; wherein, in a forward conduction state of the semiconductor device, current flows between the first contact and the second contact through the epitaxial structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of fabricating a semiconductor device, comprising:
- providing an epitaxial structure on a first side of an N-type Silicon Carbide substrate, the epitaxial structure comprising a P-type Silicon Carbide layer adjacent to the N-type Silicon Carbide substrate;
forming one or more openings through the N-type Silicon Carbide substrate that extend from a second side of the N-type Silicon Carbide substrate to the P-type Silicon Carbide layer in the epitaxial structure, the one or more openings exposing greater than or equal to about 40% of the P-type Silicon Carbide layer;
forming a plurality of spaced apart highly doped regions in the P-type Silicon Carbide layer through the one or more openings; and
providing a contact on the second side of the N-type Silicon Carbide substrate and within the one or more openings through the N-type Silicon Carbide substrate such that the contact is in physical and electrical contact with the P-type Silicon Carbide layer. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
- providing an epitaxial structure on a first side of an N-type Silicon Carbide substrate, the epitaxial structure comprising a P-type Silicon Carbide layer adjacent to the N-type Silicon Carbide substrate;
Specification