Wafer-level flip chip device packages and related methods
First Claim
Patent Images
1. An electronic device comprising:
- a solid shaped volume of a polymeric binder;
suspended within the polymeric binder, a semiconductor die having a first face, a second face opposite the first face, and at least one sidewall spanning the first and second faces, the semiconductor die being a light-detecting element comprising at least one semiconductor layer configured to absorb light over a detected wavelength range and produce electrical charge therefrom;
disposed on the first face of the semiconductor die, at least two spaced-apart contacts each having a free terminal end not covered by the polymeric binder, at least one of the contacts contacting at least one said semiconductor layer of the semiconductor die; and
disposed over a portion of the polymeric binder and in electrical contact with the terminal ends of the contacts, an anisotropic conductive adhesive (ACA), wherein at least a portion of the polymeric binder is transparent to a wavelength of light within the detected wavelength range.
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Abstract
In accordance with certain embodiments, semiconductor dies are at least partially coated with a polymer and a conductive adhesive prior being bonded to a substrate having electrical traces thereon.
145 Citations
38 Claims
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1. An electronic device comprising:
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a solid shaped volume of a polymeric binder; suspended within the polymeric binder, a semiconductor die having a first face, a second face opposite the first face, and at least one sidewall spanning the first and second faces, the semiconductor die being a light-detecting element comprising at least one semiconductor layer configured to absorb light over a detected wavelength range and produce electrical charge therefrom; disposed on the first face of the semiconductor die, at least two spaced-apart contacts each having a free terminal end not covered by the polymeric binder, at least one of the contacts contacting at least one said semiconductor layer of the semiconductor die; and disposed over a portion of the polymeric binder and in electrical contact with the terminal ends of the contacts, an anisotropic conductive adhesive (ACA), wherein at least a portion of the polymeric binder is transparent to a wavelength of light within the detected wavelength range. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
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Specification