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Wafer-level flip chip device packages and related methods

  • US 9,236,502 B2
  • Filed: 10/24/2014
  • Issued: 01/12/2016
  • Est. Priority Date: 01/24/2012
  • Status: Active Grant
First Claim
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1. An electronic device comprising:

  • a solid shaped volume of a polymeric binder;

    suspended within the polymeric binder, a semiconductor die having a first face, a second face opposite the first face, and at least one sidewall spanning the first and second faces, the semiconductor die being a light-detecting element comprising at least one semiconductor layer configured to absorb light over a detected wavelength range and produce electrical charge therefrom;

    disposed on the first face of the semiconductor die, at least two spaced-apart contacts each having a free terminal end not covered by the polymeric binder, at least one of the contacts contacting at least one said semiconductor layer of the semiconductor die; and

    disposed over a portion of the polymeric binder and in electrical contact with the terminal ends of the contacts, an anisotropic conductive adhesive (ACA), wherein at least a portion of the polymeric binder is transparent to a wavelength of light within the detected wavelength range.

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