Compliant micro device transfer head array with metal electrodes
First Claim
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1. A compliant micro device transfer head array structure, comprising:
- a base substrate;
an array of compliant transfer heads formed directly over the base substrate and deflectable toward the base substrate, each compliant transfer head comprising;
a cavity into which the compliant transfer head is deflectable;
a lower insulating layer;
a spring layer directly over the lower insulating layer, wherein the spring layer includes a mesa structure protruding from a spring arm;
an upper insulating layer directly over the spring layer;
a first metal electrode directly over the upper insulating layer and the mesa structurea second metal electrode directly over the upper insulating layer and the mesa structure, wherein the first metal electrode and the second metal electrode are electrically isolated from each other; and
a dielectric layer directly covering the first metal electrode and the second metal electrode directly over the mesa structure;
a second dielectric layer formed on walls of the cavity; and
a patterned metal layer including a first metal interconnect electrically connected with the first metal electrode for each said compliant transfer head and a second metal interconnect electrically connected with the second metal electrode for each said compliant transfer head.
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Abstract
Compliant monopolar and bipolar micro device transfer head arrays and methods of formation from SOI substrates are described. In an embodiment, an array of compliant transfer heads are formed over a base substrate and deflectable toward the base substrate, and a patterned metal layer includes a metal interconnect layer electrically connected with an array of the metal electrodes in the array of compliant transfer heads.
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Citations
14 Claims
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1. A compliant micro device transfer head array structure, comprising:
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a base substrate; an array of compliant transfer heads formed directly over the base substrate and deflectable toward the base substrate, each compliant transfer head comprising; a cavity into which the compliant transfer head is deflectable; a lower insulating layer; a spring layer directly over the lower insulating layer, wherein the spring layer includes a mesa structure protruding from a spring arm; an upper insulating layer directly over the spring layer; a first metal electrode directly over the upper insulating layer and the mesa structure a second metal electrode directly over the upper insulating layer and the mesa structure, wherein the first metal electrode and the second metal electrode are electrically isolated from each other; and a dielectric layer directly covering the first metal electrode and the second metal electrode directly over the mesa structure; a second dielectric layer formed on walls of the cavity; and a patterned metal layer including a first metal interconnect electrically connected with the first metal electrode for each said compliant transfer head and a second metal interconnect electrically connected with the second metal electrode for each said compliant transfer head. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification