Sonic sensors and packages
First Claim
Patent Images
1. A sensor system comprising:
- a silicon microphone;
a controller integrated circuit coupled to the microphone;
a transmitter coupled to the controller integrated circuit and comprising a piezoelectric element; and
a housing comprising a cover portion, wherein the cover portion comprises an aperture and the piezoelectric element, and each of the microphone, the controller integrated circuit and the transmitter are provided concomitantly and without a printed circuit board within the housing.
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Accused Products
Abstract
Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver.
47 Citations
13 Claims
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1. A sensor system comprising:
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a silicon microphone; a controller integrated circuit coupled to the microphone; a transmitter coupled to the controller integrated circuit and comprising a piezoelectric element; and a housing comprising a cover portion, wherein the cover portion comprises an aperture and the piezoelectric element, and each of the microphone, the controller integrated circuit and the transmitter are provided concomitantly and without a printed circuit board within the housing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A sensor system comprising:
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a silicon microphone; a controller integrated circuit coupled to the microphone; a transmitter coupled to the controller integrated circuit and comprising a piezoelectric element; and a housing comprising a cover portion, wherein the cover portion comprises an aperture and the piezoelectric element, and the transmitter and the controller are integrated in a single chip and then integrated concomitantly within the housing with the microphone.
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Specification