Method for integrating a light emitting device
First Claim
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1. A method for integrating a light emitting device comprising:
- picking up a micro LED device from a carrier substrate with a transfer head;
placing the micro LED device on a receiving substrate;
releasing the micro LED device from the transfer head;
applying a passivation layer over the receiving substrate and laterally around the micro LED device;
hardening the passivation layer; and
etching the passivation layer, such that a top surface of the micro LED device and a top surface of a conductive line on the receiving substrate are not covered by the passivation layer, and a portion of the micro LED device and the conductive line protrude above a top surface of the passivation layer after etching the passivation layer.
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Abstract
Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.
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Citations
22 Claims
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1. A method for integrating a light emitting device comprising:
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picking up a micro LED device from a carrier substrate with a transfer head; placing the micro LED device on a receiving substrate; releasing the micro LED device from the transfer head; applying a passivation layer over the receiving substrate and laterally around the micro LED device; hardening the passivation layer; and etching the passivation layer, such that a top surface of the micro LED device and a top surface of a conductive line on the receiving substrate are not covered by the passivation layer, and a portion of the micro LED device and the conductive line protrude above a top surface of the passivation layer after etching the passivation layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for integrating a light emitting device comprising:
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applying a passivation layer over a receiving substrate; picking up a micro LED device from a carrier substrate with a transfer head; placing the micro LED device on the receiving substrate, wherein placing the micro LED device on the receiving substrate comprises punching the micro LED device through the passivation layer; releasing the micro LED device from the transfer head; hardening the passivation layer; and etching the passivation layer, such that a top surface of the micro LED device and a top surface of a conductive line on the receiving substrate are not covered by the passivation layer, and a portion of the micro LED device and the conductive line protrude above the top surface of the passivation layer after etching the passivation layer. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A light emitting device comprising:
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a bank layer; a bank structure within the bank layer; a conductive line atop the bank layer and elevated above the bank structure; a micro LED device within the bank structure; and a passivation layer that spans directly over the bank layer and within the bank structure such that a portion of the passivation layer within the bank structure is laterally around the micro LED device, wherein a portion of the micro LED device and the conductive line atop the bank layer protrude above a top surface of the passivation layer. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
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Specification