Memory with off-chip controller
First Claim
1. A method for manufacturing a memory device, the method comprising:
- forming a memory circuit on a first substrate comprising an array of memory cells having a plurality of word lines and a plurality of bit lines, the memory circuit having a first interconnect surface with a first set of interconnect locations, the first set of interconnect locations including interconnect locations electrically connected by conductors to corresponding word lines in the plurality of word lines, and interconnect locations electrically connected by conductors to bit lines in the plurality of bit lines, wherein said conductors to corresponding word lines in the plurality of word lines include extensions parallel to the word lines and overlying bit lines in the plurality of bit lines;
forming a peripheral circuit on a second substrate including sense amplifiers and circuits configured to provide control signals for operation of the memory circuit to the plurality of word lines and the plurality of bit lines, the peripheral circuit having a second interconnect surface with a second set of interconnect locations electrically connected by conductors to the peripheral circuit; and
joining the first interconnect surface of the memory circuit to the second interconnect surface of the peripheral circuit.
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Accused Products
Abstract
An integrated circuit memory device, including a memory circuit and a peripheral circuit, is described which is suitable for low cost manufacturing. The memory circuit and peripheral circuit for the device are implemented in different layers of a stacked structure. The memory circuit layer and the peripheral circuit layer include complementary interconnect surfaces, which upon mating together establish the electrical interconnection between the memory circuit and the peripheral circuit. The memory circuit layer and the peripheral circuit layer can be formed separately using different processes on different substrates in different fabrication lines. This enables the use of independent fabrication process technologies, one arranged for the memory array, and another arranged for the supporting peripheral circuit. The separate circuitry can then be stacked and bonded together.
238 Citations
16 Claims
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1. A method for manufacturing a memory device, the method comprising:
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forming a memory circuit on a first substrate comprising an array of memory cells having a plurality of word lines and a plurality of bit lines, the memory circuit having a first interconnect surface with a first set of interconnect locations, the first set of interconnect locations including interconnect locations electrically connected by conductors to corresponding word lines in the plurality of word lines, and interconnect locations electrically connected by conductors to bit lines in the plurality of bit lines, wherein said conductors to corresponding word lines in the plurality of word lines include extensions parallel to the word lines and overlying bit lines in the plurality of bit lines; forming a peripheral circuit on a second substrate including sense amplifiers and circuits configured to provide control signals for operation of the memory circuit to the plurality of word lines and the plurality of bit lines, the peripheral circuit having a second interconnect surface with a second set of interconnect locations electrically connected by conductors to the peripheral circuit; and joining the first interconnect surface of the memory circuit to the second interconnect surface of the peripheral circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A memory device comprising:
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a memory circuit on a first substrate comprising an array of memory cells having a plurality of word lines and a plurality of bit lines, the memory circuit having a first interconnect surface with a first set of interconnect locations, the first set of interconnect locations including interconnect locations electrically connected by conductors to corresponding word lines in the plurality of word lines and interconnect locations electrically connected by conductors to bit lines in the plurality of bit lines, wherein said conductors to corresponding word lines in the plurality of word lines include extensions parallel to the word lines and overlying bit lines in the plurality of bit lines; and a peripheral circuit on a second substrate including sense amplifiers and a circuit configured to provide control signals for operation of the memory circuit to the plurality of word lines and the plurality of bit lines, the peripheral circuit having a second interconnect surface with a second set of interconnect locations electrically connected by conductors to the peripheral circuit; wherein the second interconnect surface of the peripheral circuit is joined to the first interconnect surface of the memory circuit by an interconnect interface. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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Specification