Semiconductor device and method for manufacturing the same
First Claim
1. A semiconductor device comprising:
- an oxide semiconductor layer including a channel formation region, a first region, and a second region over a substrate;
a gate insulating layer over the oxide semiconductor layer;
a gate electrode layer over the gate insulating layer;
an insulating layer over the gate electrode layer and the gate insulating layer; and
a source electrode layer and a drain electrode layer over the insulating layer,wherein the first region is one of a source or drain region,wherein each of the first region and the second region includes oxygen defects due to oxygen-defect-inducing factors,wherein the second region is between the channel formation region and the first region,wherein a concentration of the oxygen-defect-inducing factors of the second region is lower than that of the first region,wherein the insulating layer includes a first part overlapping with the first region and a second part overlapping with the second region,wherein an interface between the first part and the second part is substantially aligned with an interface between the first region and the second region, andwherein the gate insulating film is over and in contact with the first region and the second region.
1 Assignment
0 Petitions
Accused Products
Abstract
A transistor including an oxide semiconductor, which has good on-state characteristics, and a high-performance semiconductor device including a transistor capable of high-speed response and high-speed operation. In the transistor including an oxide semiconductor, oxygen-defect-inducing factors are introduced (added) into an oxide semiconductor layer, whereby the resistance of a source and drain regions are selectively reduced. Oxygen-defect-inducing factors are introduced into the oxide semiconductor layer, whereby oxygen defects serving as donors can be effectively formed in the oxide semiconductor layer. The introduced oxygen-defect-inducing factors are one or more selected from titanium, tungsten, and molybdenum, and are introduced by an ion implantation method.
-
Citations
15 Claims
-
1. A semiconductor device comprising:
-
an oxide semiconductor layer including a channel formation region, a first region, and a second region over a substrate; a gate insulating layer over the oxide semiconductor layer; a gate electrode layer over the gate insulating layer; an insulating layer over the gate electrode layer and the gate insulating layer; and a source electrode layer and a drain electrode layer over the insulating layer, wherein the first region is one of a source or drain region, wherein each of the first region and the second region includes oxygen defects due to oxygen-defect-inducing factors, wherein the second region is between the channel formation region and the first region, wherein a concentration of the oxygen-defect-inducing factors of the second region is lower than that of the first region, wherein the insulating layer includes a first part overlapping with the first region and a second part overlapping with the second region, wherein an interface between the first part and the second part is substantially aligned with an interface between the first region and the second region, and wherein the gate insulating film is over and in contact with the first region and the second region. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A semiconductor device comprising:
-
an oxide semiconductor layer including a channel formation region, a first region, and a second region over a substrate; a gate insulating layer over the oxide semiconductor layer; a gate electrode layer over the gate insulating layer; an insulating layer over the oxide semiconductor layer, the insulating layer having a first surface and a second surface opposing to the first surface; and a source electrode layer and a drain electrode layer over the insulating layer, wherein the first region is one of a source or drain region, wherein each of the first region and the second region includes oxygen defects due to oxygen-defect-inducing factors, wherein the second region is between the channel formation region and the first region, wherein a concentration of the oxygen-defect-inducing factors of the second region is lower than that of the first region, wherein a part of the insulating layer overlaps with the second region, wherein the first surface of the insulating layer in the part of the insulating layer is in contact with the gate electrode, wherein the second surface of the insulating layer in the part of the insulating layer is substantially aligned with an interface between the first region and the second region, and wherein the gate insulating film is over and in contact with the first region and the second region. - View Dependent Claims (8, 9, 10, 11, 12)
-
-
13. A semiconductor device comprising:
-
an oxide semiconductor layer including a channel formation region and source and drain regions; a gate insulating layer over the oxide semiconductor layer; a gate electrode layer over the gate insulating layer; an insulating layer over the gate electrode layer; and a source electrode layer and a drain electrode layer over the insulating layer, wherein each of the source and drain regions includes oxygen defects due to elements, wherein the gate insulating film is over and in contact with the source and drain regions, wherein a concentration of the elements of the source region or the drain region is higher than that of the channel formation region, and wherein the elements are one or more selected from the group consisting of titanium, tungsten, and molybdenum. - View Dependent Claims (14, 15)
-
Specification