Electronic device housing and method for manufacturing the same

• US 9,241,435 B2
• Filed: 12/10/2012
• Issued: 01/19/2016
• Est. Priority Date: 06/01/2012
• Status: Expired due to Fees

• Current Assignee: FIH (Hong Kong) Limited (Hon Hai Precision Industry Co., Ltd.), Shenzhen Futaihong Precision Industry Company Limited (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: FIH (Hong Kong) Limited (Hon Hai Precision Industry Co., Ltd.), Shenzhen Futaihong Precision Industry Company Limited (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Ho, Po-Feng, Yan, Shi-Jie
• Primary Examiner(s): Willis, Tremesha S
• Application Number:
  US13/709,472
• Publication Number:
  US 20130321988A1
• Time in Patent Office: 1,135 Days
• Field of Search: 174/250, 174/251, 174253-258, 174/268
• US Class Current: 1/1
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 2201/0236 Plating catalyst as filler in insulating material
• CPC Class Codes: H05K 2201/0999 Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
• CPC Class Codes: H05K 3/184 using masks
• CPC Class Codes: H05K 7/00 Constructional details common to different types of electric apparatus casings, cabinets, drawers H05K5/00

Abstract

An electronic device housing includes a plastic substrate. The plastic substrate includes a first surface. The electronic device housing further includes an activating layer formed on the first surface. The activating layer contains metal powder. The activating layer defines a recessed portion. Some of the metal powder is partially exposed on the surface of the recessed portion. Some of metal powder is partially inserted into the plastic substrate corresponding to the recessed portion. The electronic device housing further includes an antenna layer formed on the recessed portion. The antenna layer is a metal layer. A method for manufacturing the electronic device housing is also disclosed.

Claims

1. An electronic device housing comprising:

a plastic substrate, the plastic substrate comprising a first surface;

an activating layer formed on the first surface, the activating layer comprising metal powder, the activating layer defining a recessed portion, some of the metal powder being partially exposed on a surface of the recessed portion, some of the metal powder being partially inserted into the plastic substrate corresponding to the recessed portion; and

an antenna layer formed on the recessed portion, the antenna layer being a metal layer;

wherein the activating layer is an ultraviolet paint layer or a thermosetting paint layer containing metal powder.

2. The electronic device housing of claim 1, wherein the metal powder is copper, silver or palladium.

3. The electronic device housing of claim 1, wherein a thickness of the activating layer is about 15 μ

m to about 20 μ

m.

4. The electronic device housing of claim 1, wherein the antenna layer has a thickness of about 10 μ

m to about 30 μ

m.

5. The electronic device housing of claim 1, wherein the antenna layer is a nickel layer, or composite layer containing a copper layer and a nickel layer.

6. The electronic device housing of claim 1, further comprising a non-conductive shielding layer formed on the activating layer except for areas defining the recessed portion.

7. The electronic device housing of claim 6, wherein the shielding layer is an ultraviolet paint layer or a thermosetting paint layer.

8. The electronic device housing of claim 7, wherein the shielding layer has a thickness of about 15 μ

m to about 25 μ

m.

9. The electronic device housing of claim 1, wherein a depth of the recessed portion is about 20 μ

m to about 35 μ

m.

15. The electronic device housing of claim 1, wherein a mass percentage of the metal powder is about 20%-34%.

10. An electronic device housing comprising:

a plastic substrate;

an activating layer formed on the plastic substrate, the activating layer comprising metal powder, some of the metal powder being partially exposed on an outer surface of the activating layer, some of the metal powder being partially inserted into the plastic substrate; and

an antenna layer formed on the activating layer, the antenna layer being a metal layer;

wherein the activating layer is an ultraviolet paint layer or a thermosetting paint layer containing metal powder.

11. The electronic device housing of claim 10, wherein the activating layer has a thickness of about 6 μ

m to about 10 μ

m.

16. The electronic device housing of claim 10, wherein a mass percentage of the metal powder is about 20%-34%.

12. A method for manufacturing an electronic device housing, comprising:

providing a plastic substrate;

forming an activating layer on the plastic substrate, the activating layer comprising metal powder;

forming a non-conductive shielding layer formed on the activating layer;

laser activating the plastic substrate and defining a recessed portion on the activating layer; and

forming an antenna layer on the recessed portion, the antenna layer being a metal layer;

wherein a paint used for forming the activating layer is ultraviolet curable paint or bakeable paint comprising metal powder, and in the ultraviolet curable paint or bakeable paint, a mass percentage of the metal powder is about 20%-34%.

13. The method for manufacturing an electronic device housing, of claim 12, wherein portions of the activating layer are laser-activated under the following parameters:

a frequency of laser beam of about 18 KHz to about 20 KHz, a power of about 2 kW to about 2.5 kW, a scanning rate of about 300 mm/s to about 500 mm/s, and a scanning energy of about 0.1 mJ to about 0.12 mJ.

14. The method for manufacturing an electronic device housing, of claim 12, wherein the antenna layer is formed by electroplating or electroless plating.