Radio frequency identification sensor assembly
First Claim
Patent Images
1. A method of using an RFID sensor assembly,providing a RFID sensor assembly including:
- a chip;
an antenna;
a sensor;
at least one electrical lead;
a laminated layer;
a substrate;
wherein the chip is in electrical contact with the antenna and communication with the sensor and can measure a property of a sensor material to determine the properties or conditions of the environment surrounding the sensor;
wherein the chip, antenna, sensor, and at least one electrical lead is secured to the substrate;
wherein the laminated layer is arranged as to create a generally sealed pouch between the substrate and the laminated layer;
storing the RFID sensor assembly for a period of time;
performing a post-manufacturing process that modifies the pouch to expose only the RFID sensor assembly to the environment while the chip, antenna, and at least one electrical lead remain within the pouch between the substrate and the laminated layer;
using the sensor to determine certain properties or conditions of the environment surrounding the sensor; and
transmitting data to an RFID reader.
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Abstract
In accordance with one embodiment, an RFID sensor assembly comprises an RFID chip, an antenna, a sensor, a substrate, and a laminated layer. The RFID chip is in electrical communication with the antenna and the sensor. The RFID chip, antenna, and sensor are secured to the substrate. The laminated layer is arranged as to create a generally airtight pouch between the substrate and the laminate layer. The laminated layer is further arranged to facilitate a post manufacturing method for exposing the contents of the pouch to the environment surrounding the RFID sensor assembly.
21 Citations
25 Claims
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1. A method of using an RFID sensor assembly,
providing a RFID sensor assembly including: -
a chip; an antenna; a sensor; at least one electrical lead; a laminated layer; a substrate; wherein the chip is in electrical contact with the antenna and communication with the sensor and can measure a property of a sensor material to determine the properties or conditions of the environment surrounding the sensor; wherein the chip, antenna, sensor, and at least one electrical lead is secured to the substrate; wherein the laminated layer is arranged as to create a generally sealed pouch between the substrate and the laminated layer; storing the RFID sensor assembly for a period of time; performing a post-manufacturing process that modifies the pouch to expose only the RFID sensor assembly to the environment while the chip, antenna, and at least one electrical lead remain within the pouch between the substrate and the laminated layer; using the sensor to determine certain properties or conditions of the environment surrounding the sensor; and transmitting data to an RFID reader. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification