Power semiconductor device and method of manufacturing the same
First Claim
1. A power semiconductor device comprising:
- a base substrate having one surface and an other surface opposing the one surface and comprising a first conductive type drift layer;
a second conductive type semiconductor substrate disposed on the other surface of the base substrate;
a second conductive type well layer disposed under the one surface of the base substrate;
a first conductive type diffusion layer disposed in the base substrate, formed to be spaced apart from the well layer in a first direction, and having an impurity concentration higher than that of the drift layer;
a trench formed from the one surface of the base substrate including the well layer so as to penetrate through the diffusion layer in the first direction;
an insulation film disposed on the one surface of the base substrate including an inner wall of the trench; and
a first electrode disposed in the trench,wherein a peak point of an impurity doping concentration of the diffusion layer in a second direction perpendicular to the first direction is positioned in a region contacting a side surface of the trench.
1 Assignment
0 Petitions
Accused Products
Abstract
A power semiconductor device may include: a base substrate including a first conductive type drift layer; a second conductive type semiconductor substrate disposed on the other surface of the base substrate; a first conductive type diffusion layer disposed in the base substrate and having an impurity concentration higher than that of the drift layer; a second conductive type well layer disposed inside of one surface of the base substrate; a trench formed from one surface of the base substrate including the well layer so as to penetrate through the diffusion layer in a depth direction; a first insulation film disposed on a surface of the base substrate; and a first electrode disposed in the trench. A peak point of an impurity doping concentration of the diffusion layer in a transverse direction may be positioned in a region contacting a side surface of the trench.
-
Citations
7 Claims
-
1. A power semiconductor device comprising:
-
a base substrate having one surface and an other surface opposing the one surface and comprising a first conductive type drift layer; a second conductive type semiconductor substrate disposed on the other surface of the base substrate; a second conductive type well layer disposed under the one surface of the base substrate; a first conductive type diffusion layer disposed in the base substrate, formed to be spaced apart from the well layer in a first direction, and having an impurity concentration higher than that of the drift layer; a trench formed from the one surface of the base substrate including the well layer so as to penetrate through the diffusion layer in the first direction; an insulation film disposed on the one surface of the base substrate including an inner wall of the trench; and a first electrode disposed in the trench, wherein a peak point of an impurity doping concentration of the diffusion layer in a second direction perpendicular to the first direction is positioned in a region contacting a side surface of the trench. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A power semiconductor device comprising:
-
a base substrate having one surface and an other surface opposing the one surface and comprising a first conductive type drift layer; a second conductive type semiconductor substrate formed on the other surface of the base substrate; a second conductive type well layer formed under the one surface of the base substrate; a first conductive type diffusion layer formed in the base substrate, formed to be spaced apart from the well layer in a depth direction, and having an impurity concentration higher than that of the drift layer; a trench formed from the one surface of the base substrate including the well layer so as to penetrate through the diffusion layer in the depth direction; a first insulation film formed on the one surface of the base substrate including an inner wall of the trench; and a first electrode formed in the trench, wherein a peak point of an impurity doping profile of the diffusion layer in the depth direction is positioned in a region between a lower surface of the well layer and a lower surface of the trench.
-
Specification