Thin film deposition

• US 9,246,036 B2
• Filed: 08/20/2012
• Issued: 01/26/2016
• Est. Priority Date: 08/20/2012
• Status: Active Grant

• Current Assignee: Universal Display Corporation
• Original Assignee: Universal Display Corporation
• Inventors: Ma, Ruiqing, Xia, Chuanjun, Mandlik, Prashant
• Primary Examiner(s): Thompson, Timothy
• Assistant Examiner(s): PIZZUTO, CHARLES M
• Application Number:
  US13/589,622
• Publication Number:
  US 20140049923A1
• Time in Patent Office: 1,254 Days
• Field of Search: 174/506
• US Class Current: 1/1
• CPC Class Codes: H01L 2933/0025 relating to coatings
• CPC Class Codes: H01L 31/048 Encapsulation of modules
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 59/873 Encapsulations
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/135 using ink-jet printing
• CPC Class Codes: H10K 71/861 Repairing
• CPC Class Codes: H10K 85/141 comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
• CPC Class Codes: H10K 85/40 Organosilicon compounds, e.g. TIPS pentacene
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy
• CPC Class Codes: Y02E 10/549 Organic PV cells

Abstract

A method of preparing a surface for deposition of a thin film thereon, wherein the surface including a plurality of protrusions extending therefrom and having shadowed regions, includes locally treating at least one of the protrusions.

Claims

1. A method of preparing a surface for deposition of a thin film thereon, the surface including a plurality of protrusions extending therefrom and having shadowed regions, comprising:

defining a threshold value for at least one measurable aspect of the protrusions to determine protrusions for which local treatment is to be effected; and

locally treating protrusions for which the measurable aspect exceeds the threshold value.

2. The method of claim 1 wherein the at least one measurable aspect is a dimension of the protrusions, a projected area of the protrusions, or a volume of the protrusions.

3. The method of claim 1 wherein locally treating comprises removal of the at least one protrusion or reduction in size of the at least one protrusion.

4. A method of preparing a surface for deposition of a thin film thereon, the surface including a plurality of protrusions extending therefrom and having shadowed regions, comprising:

locally treating at least one of the protrusions, wherein the at least one protrusion is a defect, wherein the defect comprises a particle on the surface.

5. A method of preparing a surface for deposition of a thin film thereon, the surface including a plurality of protrusions extending therefrom and having shadowed regions, comprising:

locally treating at least one of the protrusions, wherein a plurality of the protrusions are locally treated, resulting in treatment of less than 10% of an area of the surface.

6. The method of claim 5 wherein the plurality of the protrusions are locally treated, resulting in treatment of less than 1% of the area of the surface.

7. A method of preparing a surface for deposition of a thin film thereon, the surface including a plurality of protrusions extending therefrom and having shadowed regions, comprising:

locally treating at least one of the protrusions, wherein locally treating the at least one protrusion results in reduction of a volume associated with a shadowed region of the at least one protrusion, wherein locally treating comprises reducing a volume associated with a shadowed region of the at least one protrusion.

8. The method of claim 7 wherein locally treating comprises applying a material to the at least one protrusion to reduce the volume associated with the shadowed region of the at least one protrusion.

9. The method of claim 7 further comprising scanning the surface to determine a location on the surface for which a measurable aspect of the protrusions exceeds a threshold value.

10. The method of claim 7 wherein a threshold value is determined at least in part on a basis of a total actual cycle time required to cover protrusions that do not exceed the threshold value in a thin film deposition process.

11. The method of claim 8 wherein application of the material results in a surface of the material extending beyond the perimeter of the protrusion.

12. The method of claim 8 wherein the material is a liquid.

13. The method of claim 8 wherein the material is applied by inkjet printing or drop coating to protrusions for which a measurable aspect exceeds a threshold value.

14. The method of claim 8 further comprising applying a thin barrier layer prior to applying the material to the at least one protrusion to protect against damage.

15. The method of claim 8 wherein the surface is flexible and the protrusion is a particle defect, and wherein application of the material results in fixing of a position of the particle defect relative to the surface.

16. The method of claim 11 wherein the application of the material results in the surface of the material having an average perimeter which increases in a downward direction.

17. The method of claim 12 wherein the liquid comprises a precursor to a polymer.

18. The method of claim 12 further comprising effecting at least one treatment whereby a surface of the protrusion adjacent to the shadowed region is caused to have affinity for the liquid greater than an affinity of a remainder of the surface of the protrusion for the liquid and greater than an affinity of a surface for the liquid.

19. The method of claim 17 further comprising polymerizing the precursor.

21. The method of claim 17 wherein the liquid comprises acrylate compounds or epoxy compounds.

23. The method of claim 18 further comprising:

applying the liquid to at least a portion of the surface including the plurality of protrusions; and

removing a bulk of the liquid in a manner such that some of the liquid remains only in a vicinity of the surface of the protrusions adjacent to the shadowed region.

24. The method of claim 23 further comprising applying a thin barrier layer prior to applying the liquid to protect against damage.

25. The method of claim 9 wherein desired topological features other than protrusions are determined and excluded from analysis for local treatment.

26. The method of claim 14 wherein the thin barrier layer comprises at least one of an inorganic material, an organic material, or a metallic material.

27. The method of claim 14 wherein the thin barrier layer is deposited by chemical vapor deposition, sputtering, e-beam, atomic layer deposition, evaporation, or spin coating.

28. The method of claim 26 wherein the inorganic material is an oxide, a nitride, or an oxynitride.

29. The method of claim 26 wherein the organic material is an acrylate or a siloxane.

20. The method of 17 wherein a surface of the protrusion adjacent to the shadowed region has affinity for the liquid.

22. The method of claim 20 wherein the surface of the protrusion adjacent to the shadowed region is hydrophobic and the liquid is non-polar or the surface of the protrusion adjacent to the shadowed region is hydrophilic and the liquid is polar.

30. A method of preparing a surface for deposition of a thin film thereon, the surface including a plurality of protrusions extending therefrom and having shadowed regions, comprising:

locally treating at least one of the protrusions, wherein the surface is a surface of a microelectronic device and the thin film is to be deposited to encapsulate the microelectronic device, wherein the microelectronic device comprises an integrated circuit, a charge coupled device, a light emitting diode, a light emitting polymer device, an organic light emitting device, a metal sensor pad, a micro-disk laser, an electrochromic device, a photochromic device, a display, an organic electronic device, a microelectromechanical system, a thin film transistor, or a solar cell.

31. The method of claim 30 wherein the microelectronic device is formed on at least one flexible substrate.

32. The method of claim 30 wherein the microelectronic device comprises an organic light emitting diode.