Semiconductor light emitting device and method for manufacturing semiconductor light emitting device

• US 9,246,065 B2
• Filed: 09/19/2014
• Issued: 01/26/2016
• Est. Priority Date: 06/07/2010
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Naka, Tomomichi
• Primary Examiner(s): Such, Matthew W
• Assistant Examiner(s): Kalam, Abul
• Application Number:
  US14/491,719
• Publication Number:
  US 20150044793A1
• Time in Patent Office: 494 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

According to one embodiment, a semiconductor light emitting device includes a light emitting section, a light transmitting section, a wavelength conversion section, a first conductive section, a second conductive section and a sealing section. The light emitting section includes a first major surface, a second major surface opposite from the first major surface, and a first electrode section and a second electrode section formed on the second major surface. The light transmitting section is provided on a side of the first major surface. The wavelength conversion section is provided over the light transmitting section. The wavelength conversion section is formed from a resin mixed with a phosphor, and hardness of the cured resin is set to exceed 10 in Shore D hardness.

Claims

1. A method for manufacturing a semiconductor light emitting device, the device including:

a light emitting section including a first major surface, a second major surface opposite from the first major surface, and a first electrode section and a second electrode section formed on the second major surface;

a light transmitting section provided on a side of the first major surface; and

a wavelength conversion section provided on a side of the first major surface and formed from a resin mixed with a phosphor,

the method comprising;

integrally forming the semiconductor light emitting device in a plurality; and

singulating the plurality of integrally formed semiconductor light emitting devices,

wherein integrally forming comprises;

forming the light emitting section on a substrate;

peeling the light emitting section from the substrate;

forming the light transmitting section on the peeled light emitting section; and

forming the wavelength conversion section provided over the light transmitting section, and including a cutting line for singulating,

in forming the light transmitting section, the shape of the light transmitting section is changed such that an optical path length in the wavelength conversion section is adjusted to suppress chromaticity shift in accordance with an emission characteristic of the light emitting section,

in forming the wavelength conversion section, a thickness of the wavelength conversion section is changed such that the optical path length in the wavelength conversion section is adjusted to suppress chromaticity shift by the light transmitting section, and

in forming the wavelength conversion section, setting a hardness of the resin to exceed 30 in Shore D hardness such that the phosphor included in the wavelength conversion section is inhibited from desorption from the resin.

2. The method according to claim 1, further comprising:

in the singulating, the wavelength conversion section being cut using a blade dicing method.

3. The method according to claim 1, wherein the hardness of the resin is controlled by adding an additive for increasing cross-linking sites of the resin.

4. The method according to claim 1, wherein the resin is at least one selected from the group consisting of epoxy resin, silicone resin, methacrylic resin (PMMA), polycarbonate (PC), cyclic polyolefin (COP), alicyclic acrylate (OZ), allyldiglycol carbonate (ADC), acrylic resin, fluororesin, a hybrid resin of silicone resin and epoxy resin, and urethane resin.

5. The method according to claim 1, wherein the resin is at least one selected from the group consisting of methylphenyl silicone, dimethyl silicone, and a hybrid resin of methylphenyl silicone and epoxy resin.

6. The method according to claim 1, wherein the phosphor has an emission wavelength of 380 nm or more and 720 nm or less, and includes at least one element selected from the group consisting of silicon (Si), aluminum (Al), titanium (Ti), germanium (Ge), phosphorus (P), boron (B), yttrium (Y), alkaline earth element, sulfide element, rare earth element, and nitride element.

7. The method according to claim 1, wherein in forming the wavelength conversion section, a convex shape having a curvature radius of 250 nm or more is formed in the wavelength conversion section.

8. The method according to claim 1, wherein in forming the wavelength conversion section, a concave shape having a curvature radius of 200 nm or more is formed in the wavelength conversion section.