Power reception device and power transmission device

• US 9,246,553 B2
• Filed: 07/25/2012
• Issued: 01/26/2016
• Est. Priority Date: 01/29/2010
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Ichikawa, Keiichi, Bondar, Henri
• Primary Examiner(s): Berhanu, Samuel
• Assistant Examiner(s): Rankine, Tarikh
• Application Number:
  US13/557,273
• Publication Number:
  US 20120286742A1
• Time in Patent Office: 1,280 Days
• Field of Search: 320/137, 320/108
• US Class Current: 1/1
• CPC Class Codes: H02J 50/05 using capacitive coupling
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H02J 50/70 involving the reduction of electric, magnetic or electromagnetic leakage fields
• CPC Class Codes: H02J 7/0042 characterised by the mechanical construction
• CPC Class Codes: H04B 5/22 Capacitive coupling
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer
• CPC Class Codes: H04L 25/0266 Arrangements for providing Galvanic isolation, e.g. by means of magnetic or capacitive coupling

Abstract

A power reception device and a power transmission device which are capable of suppressing an adverse effect of an electric field. A power reception device includes a capacitive coupling electrode comprising a high voltage side conductor and a low voltage side conductor extending around the high voltage side conductor. The high voltage side conductor is disposed on a surface of a housing. The low voltage side conductor is disposed inside a circuit board. A plurality of module parts are mounted on a surface of the circuit board which is located on an opposite side away from the high voltage side conductor with respect to the low voltage side conductor.

Claims

1. A power reception device for use in a power transfer system configured to transfer electric power through capacitive coupling, the power reception device comprising:

a power reception device side capacitive coupling electrode comprising a high voltage side conductor and a low voltage side conductor extending around the high voltage side conductor; and

an electric feeder circuit configured to feed electric power induced between the high voltage side conductor and the low voltage side conductor to a load,

wherein the electric feeder circuit comprises module parts and at least one of the module parts is an active part disposed in the power reception device such that the low voltage side conductor is positioned between the active part and the high voltage side conductor.

2. The power reception device according to claim 1, wherein the electric feeder circuit includes at least one of a step-down circuit, a rectifier circuit and a charger circuit.

3. The power reception device according to claim 1, wherein the module parts of the electric feeder circuit are mounted on a circuit board, and the low voltage side conductor is located in the circuit board.

4. The power reception device according to claim 3, wherein the module parts are encapsulated within a resin.

5. The power reception device according to claim 3, wherein the high voltage side conductor is encapsulated within a resin and integrated with the circuit board.

6. The power reception device according to claim 1, wherein the low voltage side conductor is shaped so as to surround the high voltage side conductor in a plane.

7. The power reception device according to claim 1, further comprising a housing which houses the high voltage side conductor, the low voltage side conductor, the electric feeder circuit, and the load therein.

8. The power reception device according to claim 1, wherein the load is a secondary battery which is disposed on the side of the low voltage side conductor opposite to the high voltage side conductor.

9. The power reception device according to claim 1, wherein the active part is encapsulated within a resin.

10. The power reception device according to claim 1, wherein the low voltage side conductor includes a first main surface and a second main surface opposite the first main surface and all of the module parts are disposed on a side of the first main surface of the low voltage side conductor and the high voltage side conductor is disposed on a side of the second main surface of the low voltage side conductor.

11. The power reception device according to claim 10, wherein all the module parts are encapsulated within a resin.

12. The power reception device according to claim 1, wherein the high voltage side conductor is encapsulated within a resin.

13. The power reception device according to claim 1, wherein the high voltage side conductor and the low voltage side conductor are located within a multilayer board.

14. The power reception device according to claim 13, wherein the high voltage side conductor is located at a surface layer of the multilayer board.

15. The power reception device according to claim 13, wherein the low voltage side conductor is shaped so as to surround the high voltage side conductor in a plane.

16. The power reception device according to claim 15, wherein the low voltage side conductor is further shaped so as to extend along at least one side of the multilayer board.

17. A power transmission device for use in a power transfer system configured to transfer electric power through capacitive coupling, the power transmission device comprising:

a power transmission device side capacitive coupling electrode comprising a high voltage side conductor and a low voltage side conductor extending around the high voltage side conductor; and

a high-frequency high-voltage generator configured to apply a high voltage of high frequency to between the high voltage side conductor and the low voltage side conductor,

wherein the high-frequency high-voltage generator comprises module parts and at least one of the module parts is an active part disposed in the power transmission device such that the low voltage side conductor is positioned between the active part and the high voltage side conductor.

18. The power transmission device according to claim 17, wherein the module parts forming the high-frequency high-voltage generator are mounted on a circuit board, and the low voltage side conductor is located in the circuit board.

19. The power transmission device according to claim 17, wherein the low voltage side conductor is shaped so as to surround the high voltage side conductor in a plane.

20. The power transmission device according to claim 17, further comprising a housing which houses the high voltage side conductor, the low voltage side conductor, and the high-frequency high-voltage generator therein.