Electronic device and manufacturing method thereof, electronic apparatus, and moving body

• US 9,247,664 B2
• Filed: 04/02/2013
• Issued: 01/26/2016
• Est. Priority Date: 04/04/2012
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Takizawa, Teruo
• Primary Examiner(s): Chapman, Jr., John
• Application Number:
  US13/855,035
• Publication Number:
  US 20130265701A1
• Time in Patent Office: 1,029 Days
• Field of Search: 734/93, 735/10
• US Class Current: 1/1
• CPC Class Codes: B81B 7/0041 maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: B81C 2203/0145 Hermetically sealing an opening in the lid
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis
• CPC Class Codes: G01C 19/5747 each sensing mass being connected to a driving mass, e.g. driving frames
• CPC Class Codes: G01P 15/097 by vibratory elements
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 5/069 Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

An electronic device includes a substrate, a cover body which is placed on the substrate, a first cavity which is surrounded by the substrate and the cover body, and a second cavity which is surrounded by the substrate and the cover body, wherein an inner portion of the first cavity is sealed in a first air pressure atmosphere, and an inner portion of the second cavity is sealed in a second air pressure atmosphere which has a difference of air pressure with respect to the first air pressure atmosphere, a first through-hole, which communicates with the first cavity and is blocked by a seal member, is provided in at least one of the substrate and the cover body, and the first cavity and the second cavity are isolated from each other by a partition wall portion which is integrally provided to the cover body or the substrate.

Claims

1. An electronic device comprising:

a substrate;

a cover body which is placed above the substrate, the cover body having a cover top surface and a cover bottom surface opposite to the cover top surface;

a first function element which is provided in a first cavity which is formed by the substrate and the cover body; and

a second function element which is provided in a second cavity which is formed by the substrate and the cover body,

wherein an inner portion of the first cavity is sealed in a first air pressure atmosphere, and an inner portion of the second cavity is sealed in a second air pressure atmosphere which has a difference of air pressure with respect to the first air pressure atmosphere,

a first through-hole, which communicates with the first cavity and is blocked by a seal member, is provided in the cover body, the first through-hole has a through-hole bottom surface, and the through-hole bottom surface is parallel to the cover top surface,

a communication hole is provided at the through-hole bottom surface, the first through-hole communicates with the first cavity via the communication hole, and the through-hole bottom surface is located between the cover top surface and the cover bottom surface so that the through-hole bottom surface is spaced apart from the cover bottom surface in a cross sectional view, and

the first cavity and the second cavity are isolated from each other by a partition wall portion which is integrally provided to the cover body or the substrate.

2. The electronic device according to claim 1,

wherein a second through-hole, which communicates with the second cavity and is blocked by a seal member, is provided in at least one of the substrate and the cover body.

3. The electronic device according to claim 2,

wherein the first through-hole and the second through-hole do not overlap with the first function element and the second function element in a plan view of the electronic device.

4. A portable phone comprising the electronic device according to claim 3.

5. A portable phone comprising the electronic device according to claim 2.

6. An automobile comprising the electronic device according to claim 2.

7. The electronic device according to claim 1,

wherein the first through-hole does not overlap with the first function element and the second function element in a plan view of the electronic device.

8. A portable phone comprising the electronic device according to claim 7.

9. An automobile comprising the electronic device according to claim 7.

10. The electronic device according to claim 1,

wherein a material of the substrate is glass and a material of the cover body is silicon.

11. The electronic device according to claim 1,

wherein the first function element detects physical quantities different from the second function element.

12. A portable phone comprising the electronic device according to claim 1.

13. An automobile comprising the electronic device according to claim 1.

14. A manufacturing method of an electronic device, comprising:

placing a first function element and a second function element above a substrate;

placing a cover body on the substrate, accommodating the first function element in a first cavity which is formed by the substrate and the cover body, and accommodating the second function element in a second cavity which is formed by the substrate and the cover body, the cover body having a cover top surface and a cover bottom surface opposite to the cover top surface; and

sealing the first cavity in a first air pressure atmosphere and sealing the second cavity in a second air pressure atmosphere which has a difference of air pressure with respect to the first air pressure atmosphere,

wherein the first cavity and the second cavity are isolated from each other by a partition wall portion which is integrally provided to the cover body or the substrate,

wherein a first through-hole is provided in the cover body, the first through-hole has a through-hole bottom surface, and the through-hole bottom surface is parallel to the cover top surface, and

wherein a communication hole is provided at the through-hole bottom surface, the first through-hole communicates with the first cavity via the communication hole, and the through-hole bottom surface is located between the cover top surface and the cover bottom surface so that the through-hole bottom surface is spaced apart from the cover bottom surface in a cross sectional view.

15. The manufacturing method of an electronic device according to claim 14,

wherein a second through-hole which communicates with the second cavity is provided in at least one of the substrate and the cover body,

the sealing includes a first sealing of sealing the first cavity by blocking the first through-hole by a seal member in the first air pressure atmosphere, and a second sealing of sealing the second cavity by blocking the second through-hole by a seal member in the second air pressure atmosphere after the first sealing, and

the first air pressure atmosphere is air pressure lower than the second air pressure atmosphere.

16. The manufacturing method of an electronic device according to claim 14,

wherein

the sealing includes a first sealing of sealing the second cavity in the second air pressure atmosphere by performing the placing and the accommodating in the second air pressure atmosphere, and a second sealing of sealing the first cavity by blocking the first through-hole by the seal member in the first air pressure atmosphere after the first sealing.

17. The manufacturing method of an electronic device according to claim 16,

wherein the second air pressure atmosphere is air pressure lower than the first air pressure atmosphere.

18. The manufacturing method of an electronic device according to claim 16,

wherein the second air pressure atmosphere is air pressure higher than the first air pressure atmosphere.

19. The manufacturing method of an electronic device according to claim 14,

wherein a material of the substrate is glass and a material of the cover body is silicon.

20. The manufacturing method of an electronic device according to claim 14,

wherein the first function element detects physical quantities different from the second function element.