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Application of fluids to substrates

  • US 9,248,466 B2
  • Filed: 05/10/2013
  • Issued: 02/02/2016
  • Est. Priority Date: 05/10/2013
  • Status: Active Grant
First Claim
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1. A method comprising:

  • applying a glue to one of a semiconductor substrate or a carrier;

    dispersing the glue on the one of the substrate or the carrier;

    applying a predetermined local heating to the glue while dispersing the glue on the one of the substrate or the carrier to obtain a desired thickness profile, wherein the desired thickness profile is a flat profile within a predetermined tolerance;

    mounting the other one of the substrate or the carrier onto the one of the substrate or the carrier with the glue sandwiched between the substrate and the carrier; and

    grinding the substrate while the substrate is mounted to the carrier.

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