Application of fluids to substrates
First Claim
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1. A method comprising:
- applying a glue to one of a semiconductor substrate or a carrier;
dispersing the glue on the one of the substrate or the carrier;
applying a predetermined local heating to the glue while dispersing the glue on the one of the substrate or the carrier to obtain a desired thickness profile, wherein the desired thickness profile is a flat profile within a predetermined tolerance;
mounting the other one of the substrate or the carrier onto the one of the substrate or the carrier with the glue sandwiched between the substrate and the carrier; and
grinding the substrate while the substrate is mounted to the carrier.
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Abstract
Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.
7 Citations
10 Claims
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1. A method comprising:
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applying a glue to one of a semiconductor substrate or a carrier; dispersing the glue on the one of the substrate or the carrier; applying a predetermined local heating to the glue while dispersing the glue on the one of the substrate or the carrier to obtain a desired thickness profile, wherein the desired thickness profile is a flat profile within a predetermined tolerance; mounting the other one of the substrate or the carrier onto the one of the substrate or the carrier with the glue sandwiched between the substrate and the carrier; and grinding the substrate while the substrate is mounted to the carrier. - View Dependent Claims (2, 3, 4)
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5. A method comprising:
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applying a glue to one of a semiconductor substrate or a carrier; dispersing the glue over the one of the substrate or the carrier; measuring a glue thickness of the glue over the one of the substrate or the carrier; adjusting a local heating of the glue according to a spatial heat pattern across the one of the substrate or the carrier while dispersing the glue on the substrate to obtain a desired thickness profile of the glue, wherein the desired thickness profile is a flat profile within a predetermined tolerance; mounting the other one of the substrate or the carrier onto the one of the substrate or the carrier with the glue sandwiched between the substrate and the carrier; and grinding the substrate while the substrate is mounted to the carrier. - View Dependent Claims (6, 7, 8, 9, 10)
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Specification