High efficiency SSL thermal designs for traditional lighting housings

• US 9,249,966 B1
• Filed: 11/11/2013
• Issued: 02/02/2016
• Est. Priority Date: 11/09/2012
• Status: Active Grant

• Current Assignee: OptoElectronix, Inc.
• Original Assignee: OptoElectronix, Inc.
• Inventors: Hooi, Yap Peng, Chuan, Kow Chuong, Vooi, Kok Chin, Kiat, Jebby Foo Heng
• Primary Examiner(s): HAN, JASON
• Application Number:
  US14/076,544
• Time in Patent Office: 813 Days
• Field of Search: 362/249.02, 362/294, 362/311.02, 362/800
• US Class Current: 1/1
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21V 29/503 of light sources cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H01L33/64
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/76 with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 5/04 of lens shape
• CPC Class Codes: F21Y 2103/20 of polygonal shape, e.g. square or rectangular
• CPC Class Codes: F21Y 2105/16 square or rectangular, e.g. for light panels
• CPC Class Codes: F21Y 2105/18 annular; polygonal other than square or rectangular, e.g. for spotlights or for generating an axially symmetrical light beam
• CPC Class Codes: F21Y 2113/00 Combination of light sources
• CPC Class Codes: F21Y 2113/13 comprising an assembly of point-like light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

A solid state lighting apparatus comprising a base unit, LED Printed Circuit Assembly comprising a plurality of LEDs, conductive enhancing structure, temperature sensor, Power Supply Printed Circuit Assembly, and optics portion comprising at least one of a lens, holding device, mirror, reflector and/or other optical components. A solid state lighting apparatus is adapted for existing luminaire shapes and is applicable for retrofitting installed luminaires.

Claims

1. A solid state lighting apparatus comprising;

a solid state lighting array comprising a plurality of LEDs and a substrate;

a first heat sink operable to support a substrate on which the solid state lighting array is mounted comprising a flexible portion;

an expander portion comprising electrical components and at least one tension screw;

a lens assembly comprising at least one optical component for each LED wherein the lens assembly is placed over the LEDs on the first heat sink such that each LED is focused in a predetermined manner; and

an outer cover operable to function as a second heat sink;

wherein the expander portion is operable to radially expand against the flexible portion when at least one tension screw is tightened into the expander portion such that the flexible portion is placed in thermal communication with the outer cover.

2. The solid state lighting apparatus of claim 1 wherein the lens assembly comprises at least one optical component chosen from a group consisting of side emitting lens, image forming aspheric lens, horizontally isotropic lens, holographic engineered diffuser lens, and aspheric collimating lens and mirror.

3. The solid state lighting apparatus of claim 1 wherein the electrical components comprise at least one chosen from a group consisting of dynamic bleeder, discontinuous mode controller, boost converter, thermal foldback unit, thermal feedback module, temperature sensor, means for communication, means for computing, means for dimming and means for modulating color of the LEDs and power supply.

4. The solid state lighting apparatus of claim 1 wherein the outer cover is chosen from a group consisting of cylinders, cones, ellipsoids and other shapes operable to make thermal contact with a flexible, expandable heat sink.

5. The solid state lighting apparatus of claim 1 wherein the plurality of LEDs are maintained at a temperature of 85°

C. or less when dissipating less than about 300 watts.