Selective deposition of magnetic particles and using magnetic material as a carrier medium to deposit nanoparticles

• US 9,251,458 B2
• Filed: 03/26/2014
• Issued: 02/02/2016
• Est. Priority Date: 09/11/2011
• Status: Active Grant

• Current Assignee: AmaTech Group Limited (Paragon Group Limited)
• Original Assignee: Féinics AmaTech Teoranta (Paragon Group Limited)
• Inventors: Finn, David, Lotya, Mustafa
• Primary Examiner(s): Haupt, Kristy A
• Application Number:
  US14/225,570
• Publication Number:
  US 20140209691A1
• Time in Patent Office: 678 Days
• US Class Current: 1/1
• CPC Class Codes: G06K 19/07769 the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• CPC Class Codes: G06K 19/07794 the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
• CPC Class Codes: H01F 27/36 Electric or magnetic shields or screens movable for varying inductance H01F21/10
• CPC Class Codes: H01F 27/361 made of combinations of electrically conductive material and ferromagnetic material
• CPC Class Codes: H01F 27/363 made of electrically conductive material
• CPC Class Codes: H01F 27/366 made of ferromagnetic material
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01F 41/16 the magnetic material being applied in the form of particles, e.g. by serigraphy , to form thick magnetic films or precursors therefor H01F41/18 -H01F41/24 take precedence
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H05K 1/0233 Filters, inductors or a magnetic substance
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/0218 Composite particles, i.e. first metal coated with second metal
• CPC Class Codes: H05K 2201/0723 provided by an inner layer of PCB
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 3/1275 by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Abstract

Selective deposition of magnetic material such as particles, and producing a pre-laminated stack of shielding layers for offsetting attenuation of RF caused by a metal face plate of a smart card (or tag) or a metallized layer near a passive transponder. Coated or uncoated magnetic particles of different sizes may be used to increase the packing density of the material after its deposition on a substrate. Magnetography-based techniques may be used to apply the particles, at high packing density, including different-sized particles to a substrate such as PVC. Magnetic particles may be used as a carrier medium to deposit other particles nanoparticles. A system for selective deposition is disclosed.

Claims

1. An RFID device comprising an RFID chip, a module antenna connected with the RFID chip, and a booster antenna disposed in a layer of the device;

further comprising;

one or more shielding layers comprising a layer of synthetic material selectively coated with magnetic material to create an electronic laminate for the RFID device;

wherein the one or more shielding layers comprise areas of magnetic material selectively disposed in a pattern corresponding to and covering at least a portion of one of more components of the booster antenna; and

wherein the one or more shielding layers are formed to cover only booster antenna components, rather than an entire surface of the inlay substrate.

2. The RFID device of claim 1, wherein:

the metal surface is one of a faceplate for a metal smartcard or a metal element of another electronic device.

3. The RFID device of claim 1, wherein the magnetic material comprises:

a first portion of relatively large particles; and

a second portion of relatively small particles at least partially filling voids between the relatively large particles.

4. The RFID device of claim 3, wherein:

the relatively large particles have a size of approximately 100 μ

m+/−

50 μ

m; and

the relatively small particles have a size of approximately 30 μ

m+/−

20 μ

m.

5. The RFID device of claim 1, wherein the magnetic material comprises:

magnetic particles acting as a carrier for functional materials selected from the group consisting of pigments, amorphous crystalline powders, nanoparticles, tungsten particles, copper particles, iron particles, copper oxide particles.

6. The RFID device of claim 5, wherein:

the magnetic particles, together with resin and carrier particles, form a conglomerate of material comprising a plurality of magnetic carrier particles and metal or nanoparticles embedded in a resin that can be moved and placed by selective placement on a magnetized drum and electrostatic transfer to a substrate.

7. An RFID device comprising:

a booster antenna (BA) disposed in an inlay substrate; and

a metal foil disposed on at least one side of the inlay substrate, the metal foil having a thickness less than a skin depth of the metal of the foil in order to prevent the formation of eddy currents in the metal foil that will attenuate the RF electromagnetic field.

8. The RFID device of claim 7, further comprising:

a metal faceplate disposed above one side of the inlay substrate.

9. The RFID device of claim 8, further comprising:

magnetic shielding material disposed between the metal faceplate and the inlay substrate.

10. The RFID device of claim 7, wherein:

the metal foil comprises nickel, gold and copper.

11. The RFID device of claim 7, wherein:

an overall thickness of the metal layer is be less than or equal to 18 μ

m.