Fingerprint module and manufacturing method for same
First Claim
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1. A fingerprint module comprising:
- a substrate comprising a pair of surfaces and a plurality of pads, the pair of surfaces formed on two sides of the substrate, the plurality of pads exposed on one of the pair of surfaces;
a fingerprint identification chip electrically connected with the substrate by at least a wire;
a molding layer disposed on the substrate and covering the fingerprint identification chip and the wire;
a color layer disposed on the molding layer; and
a protecting layer disposed on the color layer;
wherein the dielectric constants of the molding layer, the color layer, and the protecting layer are in the range of 15 to 45.
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Abstract
A fingerprint module of fingerprint identification chip is provided. The fingerprint module includes a substrate, a fingerprint identification chip, a molding layer, a color layer, and a protecting layer. The substrate includes a pair of surfaces and a plurality of pads. The surfaces are on the opposite sides of the substrate. The pads are exposed on one of the surfaces. The fingerprint identification chip electrically connects with the substrate according to at least a wire. The molding layer disposes on the substrate and covers the fingerprint identification chip and the wire. The color layer disposes on the molding layer. The protecting layer disposes on the color layer.
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Citations
12 Claims
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1. A fingerprint module comprising:
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a substrate comprising a pair of surfaces and a plurality of pads, the pair of surfaces formed on two sides of the substrate, the plurality of pads exposed on one of the pair of surfaces; a fingerprint identification chip electrically connected with the substrate by at least a wire; a molding layer disposed on the substrate and covering the fingerprint identification chip and the wire; a color layer disposed on the molding layer; and a protecting layer disposed on the color layer; wherein the dielectric constants of the molding layer, the color layer, and the protecting layer are in the range of 15 to 45. - View Dependent Claims (2, 3, 4, 5)
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6. A manufacturing of a fingerprint module comprising:
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providing a substrate, the substrate comprising a pair of surfaces and a plurality of pads, the pair of surfaces disposed on two different sides of the substrate and the plurality of pads exposed on one of the pair of surfaces; disposing a fingerprint identification chip on the substrate; electrically connect at least one pad and the fingerprint identification chip by reversely bonding at least a wire; forming a molding layer on the substrate after reversely bonding the wire, the molding layer covering the fingerprint identification chip and the wire; grinding the molding layer after forming the molding layer; forming a color layer on the molding layer after grinding the molding layer; and forming a protecting layer on the color layer after forming the color layer. - View Dependent Claims (7, 8, 9, 10, 11)
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12. A fingerprint module comprising:
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a substrate comprising a pair of surfaces and a plurality of pads, the pair of surfaces formed on two sides of the substrate, the plurality of pads exposed on one of the pair of surfaces; a fingerprint identification chip electrically connected with the substrate by at least a wire; a molding layer disposed on the substrate and covering the fingerprint identification chip and the wire; a color layer disposed on the molding layer; and a protecting layer disposed on the color layer; wherein the shortest distant from the surface of the molding layer to the fingerprint identification chip is in the range of 25 to 50 μ
m.
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Specification