Fingerprint module and manufacturing method for same

• US 9,252,064 B2
• Filed: 05/15/2014
• Issued: 02/02/2016
• Est. Priority Date: 02/24/2014
• Status: Expired due to Fees

• Current Assignee: Dynacard Co. Ltd., Egis Technology Inc.
• Original Assignee: Dynacard Co. Ltd., Egis Technology Inc.
• Inventors: Tsai, Pai Ching, Hwang, Nian-Horng
• Primary Examiner(s): Nhu, David
• Application Number:
  US14/279,279
• Publication Number:
  US 20150243571A1
• Time in Patent Office: 628 Days
• Field of Search: 438/106, 438/70, 438/75, 438/104, 438/124, 438/127, 438/141, 438/509, 438/584, 438/608, 438/617, 438/782, 257/233, 257/292, 257/678, 257/E21.006, 257/E21.053, 257/E21.077, 257/E21.091, 257/E21.126, 257/E21.127, 257/E21.185, 257/E21.253, 257/E21.352, 257/E21.499, 257/E21.502, 257/E21.503, 257/E21.504, 257/E21.617
• US Class Current: 1/1
• CPC Class Codes: G06V 40/12 Fingerprints or palmprints
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 21/52 Mounting semiconductor bodies in containers
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/041 the container being a hollow construction having no base used as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A fingerprint module of fingerprint identification chip is provided. The fingerprint module includes a substrate, a fingerprint identification chip, a molding layer, a color layer, and a protecting layer. The substrate includes a pair of surfaces and a plurality of pads. The surfaces are on the opposite sides of the substrate. The pads are exposed on one of the surfaces. The fingerprint identification chip electrically connects with the substrate according to at least a wire. The molding layer disposes on the substrate and covers the fingerprint identification chip and the wire. The color layer disposes on the molding layer. The protecting layer disposes on the color layer.

Claims

1. A fingerprint module comprising:

a substrate comprising a pair of surfaces and a plurality of pads, the pair of surfaces formed on two sides of the substrate, the plurality of pads exposed on one of the pair of surfaces;

a fingerprint identification chip electrically connected with the substrate by at least a wire;

a molding layer disposed on the substrate and covering the fingerprint identification chip and the wire;

a color layer disposed on the molding layer; and

a protecting layer disposed on the color layer;

wherein the dielectric constants of the molding layer, the color layer, and the protecting layer are in the range of 15 to 45.

2. The fingerprint module of claim 1, wherein the fingerprint module further comprises a protecting frame disposed on the substrate;

the protecting frame comprising an opening, the fingerprint identification chip are disposed inside the opening.

3. The fingerprint module of claim 1, wherein the materials of the molding layer, the color layer, and the protecting layer are selected form the group consisting of:

aluminum oxide, titanium dioxide, titanium carbide, chromium oxide, chromium carbide, zirconium oxide, and zirconium carbide.

4. The fingerprint module of claim 1, wherein the shortest distant from the surface of the molding layer to the fingerprint identification chip is in the range of 25 to 50 μ

m.

5. The fingerprint module of claim 1, wherein the number of the molding layer is two, and the fingerprint module further comprise at least two electronic components, the electronic components deposited on the pair of surfaces individually, the molding layers covering the pair of surfaces and the electronic components.

6. A manufacturing of a fingerprint module comprising:

providing a substrate, the substrate comprising a pair of surfaces and a plurality of pads, the pair of surfaces disposed on two different sides of the substrate and the plurality of pads exposed on one of the pair of surfaces;

disposing a fingerprint identification chip on the substrate;

electrically connect at least one pad and the fingerprint identification chip by reversely bonding at least a wire;

forming a molding layer on the substrate after reversely bonding the wire, the molding layer covering the fingerprint identification chip and the wire;

grinding the molding layer after forming the molding layer;

forming a color layer on the molding layer after grinding the molding layer; and

forming a protecting layer on the color layer after forming the color layer.

7. The manufacturing method of claim 6, wherein a protecting frame is disposed on the substrate, the protecting frame comprises an opening, and the fingerprint identification chip is disposed inside the opening.

8. The manufacturing method of claim 6, wherein the materials of the molding layer, the color layer, and the protecting layer are selected form the group consisting of:

aluminum oxide, titanium dioxide, titanium carbide, chromium oxide, chromium carbide, zirconium oxide, and zirconium carbide.

9. The manufacturing method of claim 8, wherein the dielectric constants of the molding layer, the color layer, and the protecting layer are in the range of 15 to 45.

10. The manufacturing method of claim 6, wherein the shortest distant from the surface of the molding layer to the fingerprint identification chip is in the range of 25 to 50 μ

m.

11. The manufacturing method of claim 6, wherein before forming the molding layer, the manufacturing method further comprises forming at least two electronic components disposed on the pair of surfaces individually,

wherein the number of the molding layer is two, the molding layers cover the pair of surfaces and the electronic components individually.

12. A fingerprint module comprising:

a substrate comprising a pair of surfaces and a plurality of pads, the pair of surfaces formed on two sides of the substrate, the plurality of pads exposed on one of the pair of surfaces;

a fingerprint identification chip electrically connected with the substrate by at least a wire;

a molding layer disposed on the substrate and covering the fingerprint identification chip and the wire;

a color layer disposed on the molding layer; and

a protecting layer disposed on the color layer;

wherein the shortest distant from the surface of the molding layer to the fingerprint identification chip is in the range of 25 to 50 μ

m.