Package-on-package assembly with wire bond vias

• US 9,252,122 B2
• Filed: 08/14/2013
• Issued: 02/02/2016
• Est. Priority Date: 10/17/2011
• Status: Active Grant

• Current Assignee: Adeia Semiconductor Technologies LLC (f/k/a Invensas Corporation) (Adeia Inc.)
• Original Assignee: Invensas Corporation
• Inventors: Chau, Ellis, Co, Reynaldo, Alatorre, Roseann, Damberg, Philip, Wang, Wei-Shun, Yang, Se Young
• Primary Examiner(s): SUN, YU-HSI DAVID
• Application Number:
  US13/966,636
• Publication Number:
  US 20130328219A1
• Time in Patent Office: 902 Days
• Field of Search: 257/696, 257/697, 257/693, 257/E23.023, 257/E23.024, 257/784, 438/617, 669/6, 669/7, 669/3, 6E2/302.3, 6E2/302.4
• US Class Current: 1/1
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/4554 Coating
• CPC Class Codes: H01L 2224/45565 Single coating layer
• CPC Class Codes: H01L 2224/45664 Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48145 : the bodies being stacked
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4824 : Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/48245 : the item being metallic
• CPC Class Codes: H01L 2224/48247 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48997 : Reinforcing structures
• CPC Class Codes: H01L 2224/49171 : Fan-out arrangements
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73207 : Bump and wire connectors
• CPC Class Codes: H01L 2224/73253 : Bump and layer connectors
• CPC Class Codes: H01L 2224/73257 : Bump and wire connectors
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/78301 : Capillary
• CPC Class Codes: H01L 2224/851 : the connector being supplied to the parts to be connected in the bonding apparatus
• CPC Class Codes: H01L 2224/8518 : Translational movements
• CPC Class Codes: H01L 2224/85399 : Material
• CPC Class Codes: H01L 2224/85951 : Forming additional members, e.g. for reinforcing
• CPC Class Codes: H01L 2224/85986 : Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
• CPC Class Codes: H01L 2225/06506 : Wire or wire-like electrical connections between devices
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06513 : Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06517 : Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06558 : the devices having passive surfaces facing each other, i.e. in a back-to-back arrangement
• CPC Class Codes: H01L 2225/06562 : at least one device in the stack being rotated or offset
• CPC Class Codes: H01L 2225/06565 : the devices having the same size and there being no auxiliary carrier between the devices
• CPC Class Codes: H01L 2225/06568 : the devices decreasing in size, e.g. pyramidical stack
• CPC Class Codes: H01L 2225/1023 : the support being an insulating substrate
• CPC Class Codes: H01L 2225/1029 : the support being a lead frame
• CPC Class Codes: H01L 2225/1052 : Wire or wire-like electrical connections
• CPC Class Codes: H01L 2225/1058 : Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/1088 : Arrangements to limit the height of the assembly
• CPC Class Codes: H01L 2225/1094 : Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/3114 : the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/3128 : the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/3677 : Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/4334 : Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49517 : Additional leads
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/43 : Manufacturing methods
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/78 : Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/1431 : Logic devices
• CPC Class Codes: H01L 2924/1434 : Memory
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15331 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1715 : Shape
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/20751 : larger or equal to 10 microns less than 20 microns
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20754 : larger or equal to 40 microns less than 50 microns
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/20756 : larger or equal to 60 microns less than 70 microns
• CPC Class Codes: H01L 2924/20757 : larger or equal to 70 microns less than 80 microns
• CPC Class Codes: H01L 2924/20758 : larger or equal to 80 microns less than 90 microns
• CPC Class Codes: H01L 2924/20759 : larger or equal to 90 microns less than 100 microns
• CPC Class Codes: H01L 2924/2076 : equal to or larger than 100 microns
• CPC Class Codes: H01L 2924/3511 : Warping
• CPC Class Codes: H05K 2201/10515 : Stacked components
• CPC Class Codes: H05K 2201/1053 : Mounted components directly electrically connected to each other, i.e. not via the PCB
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y10T 29/49149 : by metal fusion bonding
• CPC Class Codes: Y10T 29/49151 : by deforming or shaping

Abstract

A structure includes a substrate having a first region and a second region, the substrate also having a first surface and a second surface. Electrically conductive elements are exposed at the first surface within the second region. Wire bonds have bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. At least one of the wire bonds has a shape such that the wire bond defines an axis between the free end and the base thereof and such that the wire bond defines a plane. A bent portion of the at least one wire bond extends away from the axis within the plane. A dielectric encapsulation layer covers portions of the wire bonds such that unencapsulated portions, including the ends, of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer.

Claims

1. A structure comprising:

a substrate having a first region and a second region, the substrate also having a first surface and a second surface remote from the first surface;

electrically conductive elements exposed at the first surface of the substrate within the second region;

wire bonds having bases bonded to respective ones of the conductive elements and free ends remote from the substrate and remote from the bases, at least one of the wire bonds having a shape such that the at least one wire bond defines an axis between the free end and the base thereof coincident with a side surface of the at least one wire bond and such that the at least one wire bond defines a plane, a bent portion of the at least one wire bond extending away from the axis within the plane, wherein the entire at least one wire bond is positioned on one side of the axis and a substantially straight portion of the at least one wire bond extends between the free end and the bent portion angled relative to the bent portion,

wherein the ends of the wire bonds are defined on tips of the wire bonds, the wire bonds defining respective first diameters between the bases and the tips thereof, and the tips having at least one dimension that is smaller than the respective first diameters of the wire bonds, wherein the tip of at least one wire bond of the wire bonds is tapered relative to a cylindrical portion of the at least one wire bond and comprises first and second outer surfaces extending directly from an outer surface of the cylindrical portion, wherein the cylindrical portion is integral with the tip of the at least one wire bond and the tip of the at least one wire bond has a centroid which is offset in a radial direction from an axis of the cylindrical portion extending from the base of the at least one wire bond; and

a dielectric encapsulation layer extending from at least one of the first or second surfaces and covering portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, the encapsulation layer overlying at least the second region of the substrate, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer, the unencapsulated portions including the ends;

wherein the conductive elements are configured to couple the wire bonds to one or more microelectronic elements.

2. The structure of claim 1, further including at least one microelectronic element overlying one of the first surface or the second surface within the first region, wherein at least some of the conductive elements are electrically connected to the at least one microelectronic element.

3. The structure of claim 1, wherein the bent portion is adjacent the base of the at least one wire bond.

4. The structure of claim 1, wherein the axis is defined between a portion of the free end and a portion of the base, the axis being at and tangent to an edge surface of the wire on a side thereof opposite the bend within both portions.

5. The structure of claim 1, wherein the at least one wire bond includes only a single bent portion.

6. The structure of claim 1, wherein the axis of the shape of the at least one wire bond is at an angle of less than 90 degrees with respect to the first surface of the substrate.

7. The structure of claim 1, wherein the base of the at least one wire bond is a ball bond, the axis extending through or along a portion of the ball bond.

8. The structure of claim 7, wherein the end of the at least one wire bond is positioned directly above the base.

9. A microelectronic package comprising:

a substrate having a first region and a second region, the substrate also having a first surface and a second surface remote from the first surface;

at least one microelectronic element overlying the first surface within the first region;

electrically conductive elements exposed at the first surface of the substrate within the second region, at least some of the conductive elements being electrically connected to the at least one microelectronic element;

wire bonds having bases bonded to respective ones of the conductive elements and free ends remote from the substrate and remote from the bases, at least one of the wire bonds having a shape such that the at least one wire bond defines an axis between the free end and the base thereof coincident with a side surface of the at least one wire bond, such that the wire bond defines a plane, and such that a bent portion of the at least one wire bond is defined between the base and the end thereof, wherein the entire at least one wire bond is positioned on one side of the axis and a substantially straight portion of the at least one wire bond extends between the free end and the bent portion angled relative to the bent portion,

wherein the ends of the wire bonds are defined on tips of the wire bonds, the wire bonds defining respective first diameters between the bases and the tips thereof, and the tips having at least one dimension that is smaller than the respective first diameters of the wire bonds, wherein the tip of at least one wire bond of the wire bonds is tapered relative to a cylindrical portion of the at least one wire bond and comprises first and second outer surfaces extending directly from an outer surface of the cylindrical portion, wherein the cylindrical portion is integral with the tip of the at least one wire bond and the tip of the at least one wire bond has a centroid which is offset in a radial direction from an axis of the cylindrical portion extending from the base of the at least one wire bond; and

a dielectric encapsulation layer extending from at least one of the first or second surfaces and covering portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, the encapsulation layer overlying at least the second region of the substrate, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer, the unencapsulated portions including the ends.

10. The microelectronic package of claim 9, wherein the bent portion of the at least one wire bond extends away from the axis within the plane.

11. The microelectronic package of claim 9, wherein the bent portion is adjacent the base of the at least one wire bond.

12. The microelectronic package of claim 9, wherein the axis is defined between a portion of the free end and a portion of the base, both portions being at and tangent to an edge surface of the wire on a side thereof opposite the bend.

13. The microelectronic package of claim 9, wherein the at least one wire bond includes only a single bent portion.

14. The microelectronic package of claim 9, wherein the axis of the shape of the at least one wire bond is at an angle of less than 90 degrees with respect to the first surface of the substrate.

15. The microelectronic package of claim 9, wherein the base of the at least one wire bond is a ball bond, the axis extending through or along a portion of the ball bond.