Lighting system and method to control a lighting system

• US 9,253,848 B2
• Filed: 06/23/2014
• Issued: 02/02/2016
• Est. Priority Date: 06/21/2013
• Status: Expired due to Fees

• Current Assignee: J2 Light Inc.
• Original Assignee: J2 Light Inc.
• Inventors: Hayman, Jeff, MacGillivray, Jeremy, Bailey, Kevin, Kim, John
• Primary Examiner(s): Tan, Vibol
• Application Number:
  US14/312,198
• Publication Number:
  US 20150022094A1
• Time in Patent Office: 589 Days
• Field of Search: 362/84, 362/147, 362/223, 362/235, 362/218, 362/241, 362/222, 362/276, 362/371, 362/607, 315/152, 315/291, 315/307
• US Class Current: 1/1
• CPC Class Codes: F21K 9/60 Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
• CPC Class Codes: F21S 2/00 Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
• CPC Class Codes: F21V 15/015 Devices for covering joints between adjacent lighting devices; End coverings
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 7/005 with an elongated shape to cooperate with linear light sources
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05B 45/10 Controlling the intensity of the light
• CPC Class Codes: H05B 47/11 by determining the brightness or colour temperature of ambient light
• CPC Class Codes: H05B 47/115 by determining the presence or movement of objects or living beings
• CPC Class Codes: H05B 47/19 via wireless transmission
• CPC Class Codes: Y02B 20/40 Control techniques providing energy savings, e.g. smart controller or presence detection

Abstract

An LED lighting system is disclosed, which generally consists of an enclosure, one or more LED modules, one or more transformers, and one or more drivers. A lamp assembly is disclosed, which generally consists of one or more vertically oriented LED chips, thermally conductive shells, and a thermally dissipating means positioned at the back of the LED chips. An LED module is disclosed, which generally consists of a lamp assembly, one or more reflectors and modules caps. A method of controlling light intensities is disclosed, which generally consists of method of decreasing light intensities in areas with little occupancy while minimizing user annoyance resulting from drastic light intensity fluctuations. A universal mounting bracket is disclosed, which generally consists of a fixture plate, mounting plate, and an adjustable means.

Claims

1. A light emitting diode (LED) module comprising:

a. two or more vertically opposed LED chips which permit shaping and distribution of light emitted from the LED chips while minimizing heat insulation;

b. one or more thermally conductive shells that interact with the LED chips to conduct thermal heat from the LED chips; and

,

c. a gap positioned in between at least two of the vertically opposed LED chips.

2. The LED module of claim 1, wherein the gap has a width between 2 millimeters (mm) and 75 mm and an optimal width is based on LED chip density and heat emission.

3. The LED module of claim 1, wherein the gap is comprised of an air gap allowing for dissipation of heat through convective cooling.

4. The LED module of claim 1, wherein the gap is comprised of heat sink elements which conduct heat emanating from a back of the two vertically opposing LED chips to the one or more thermally conductive shells.

5. The LED module of claim 1, wherein the one or more thermally conducting shells further comprise a thermally conducting line interacting with a face of the LED chips to dissipate heat emitted from the LED chips to the one or more thermally conducting shells.

6. The LED module of claim 1, wherein the one or more thermally conducting shells further comprise radiating fins increasing the conduction of thermal heat by convective cooling.

7. The LED module of claim 6, wherein the radiating fins have a height from 1 mm to 75 mm, and the height is based on LED chip density and heat emission.

8. The LED module of claim 1, wherein the vertically opposed LED chips are positioned at an angle of 45-90°

with respect to top or bottom plane of the one or more thermally conductive shells.

9. A light emitting diode (LED) module comprising:

a. two or more vertically opposed LED chips which permit shaping and distribution of light emitted from the LED chips while minimizing heat insulation;

b. one or more thermally conductive shells that interact with the LED chips to conduct thermal heat from the LED chips;

c. a chip bracket which holds the LED chips and permits air flow between the LED chips to dissipate heat emitted by the LED chips; and

,

d. a gap positioned in between at least two of the vertically opposed LED chips.