Servo amplifier having cooling structure including heat sink

• US 9,253,926 B2
• Filed: 02/24/2014
• Issued: 02/02/2016
• Est. Priority Date: 02/26/2013
• Status: Active Grant

• Current Assignee: Fanuc Corporation
• Original Assignee: Fanuc Corporation
• Inventors: Okuaki, Kenichi
• Primary Examiner(s): Haughton, Anthony
• Assistant Examiner(s): AHMAD, YAHYA A.
• Application Number:
  US14/187,646
• Publication Number:
  US 20140240925A1
• Time in Patent Office: 708 Days
• Field of Search: 361688-723, 165/80.3, 165/185
• US Class Current: 1/1
• CPC Class Codes: H01L 2023/405 heatsink to package
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20409 Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Abstract

A servo amplifier includes a housing, a heat source arranged in the housing, and a heat dissipating structure including a heat sink arranged in the housing and thermally connected to the heat source. The heat sink has heat dissipating fins extending from at least a portion of a surface of the heat sink, other than a connecting face thermally connected to the heat source. The at least a portion of the surface of the heat sink, other than the connecting face, is thermally connected to a surface of the housing.

Claims

1. A servo amplifier comprising:

a housing;

a heat source arranged in the housing; and

a heat dissipating structure comprising a heat sink arranged in the housing and thermally connected to the heat source,

wherein the heat source is mounted on a printed board which is attached to the housing via a protrusion formed on an inner face of the housing,

wherein the heat sink comprises heat dissipating fins extending from at least a portion of a surface of the heat sink, other than a second connecting face which is thermally connected to the heat source, and

wherein a first connecting face of the heat sink different from the second connecting face is thermally connected to an inner face of the housing,

wherein one of the heat dissipating fins having the first connecting face has a thickness larger than the other heat dissipating fins.

2. The servo amplifier according to claim 1, wherein the first connecting face of the heat sink, which is thermally connected to the housing, is formed by a surface of the heat dissipating fin facing a surface of the housing, and arranged so as to extend perpendicular with respect to the second connecting face of the heat sink, which is thermally connected to the heat source.

3. The servo amplifier according to claim 2,

wherein the first connecting face of the heat sink and the inner face of the housing extend parallel to each other.

4. The servo amplifier according to claim 1, wherein the first connecting face of the heat sink, which is thermally connected to the housing, is formed by a surface of the heat dissipating fin facing a surface of the housing, and arranged so as to extend parallel to the second connecting face of the heat sink, which is thermally connected to the heat source.

5. The servo amplifier according to claim 4,

wherein the heat sink has a third connecting face extending perpendicular to the first connecting face, and

wherein the housing is thermally connected to the first connecting face and the third connecting face of the heat sink, respectively.

6. The servo amplifier according to claim 1, wherein a heat conducting member, which is different from the heat sink and the housing, is interposed between the heat sink and the housing.

7. The servo amplifier according to claim 1, wherein the heat sink and the housing are directly connected to each other.

8. The servo amplifier according to claim 1, wherein at least one of the heat sink and the housing has a protruding portion which protrudes to the other, and the heat sink and the housing are thermally connected to each other through the protruding portion.