Light-emitting structure

• US 9,257,622 B2
• Filed: 04/14/2014
• Issued: 02/09/2016
• Est. Priority Date: 04/14/2014
• Status: Active Grant

• Current Assignee: Lin, Jin-Ywan
• Original Assignee: Lin, Jin-Ywan
• Inventors: Lin, Jin-Ywan
• Primary Examiner(s): STARK, JARRETT J
• Application Number:
  US14/252,439
• Publication Number:
  US 20150295150A1
• Time in Patent Office: 666 Days
• Field of Search: 257/99
• US Class Current: 1/1
• CPC Class Codes: H01L 33/22 Roughened surfaces, e.g. at the interface between epitaxial layers
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/387 with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials

Abstract

A light-emitting structure includes a package substrate and a light emitter disposed on the package substrate. The package substrate includes a carrier substrate and a plurality of metal units disposed on the carrier substrate. A distance between two arbitrary points on a periphery of the metal unit is defined as a peripheral endpoint distance. The light emitter includes a first electrical metal and a second electrical metal that have different electrical polarities and are separate from each other. A shortest distance between the first electrical metal and the second electrical metal is defined as an electrical metal interval. The electrical metal interval between the first electrical metal and the second electrical metal is greater than the longest peripheral endpoint distance of the metal unit.

Claims

1. A light-emitting structure, comprising:

a package substrate, comprising a carrier substrate and a plurality of metal units disposed on the carrier substrate, each of the plurality of metal units including a contact surface, a distance between two arbitrary points on a periphery of the contact surface being defined as a peripheral endpoint distance, the carrier substrate comprising a first electrode and a second electrode disposed at one side thereof opposite to the plurality of metal units, and a plurality of electrical connecting channels penetrating through the carrier substrate; and

a light emitter, disposed on the package substrate, comprising a first electrical metal and a second electrical metal that have different electrical polarities and are separate from each other, a shortest distance between the first electrical metal and the second electrical metal being defined as an electrical metal interval, the first electrical metal including a first surface in contact with the plurality of contact surfaces to form electrical connection between them, the second electrical metal including a second surface in contact with the plurality of contact surfaces to form electrical connection between them;

wherein the electrical metal interval between the first electrical metal and the second electrical metal is greater than the longest peripheral endpoint distance of the contact surface,

wherein the plurality of metal units includes a plurality of first metal units in contact with the first electrical metal, a plurality of second metal units in contact with the second electrical metal and a plurality of third metal units located between the first electrical metal and the second electrical metal without contact with the first electrical metal, the second electrical metal and the plurality of electrical connecting channels, and

wherein the plurality of electrical connecting channels includes a plurality of first electrical connecting channels, each including two ends respectively connected to one of the plurality of first metal units and the first electrode, and a plurality of second electrical connecting channels, each including two ends respectively connected to one of the plurality of second metal units and the second electrode.

2. The light-emitting structure of claim 1, wherein the contact surfaces are formed in a shape selected from a group consisting of a rectangle, a triangle, a cross and a circle.

3. The light-emitting structure of claim 1, wherein the metal units are separate from one another and are disposed in a staggered arrangement on the carrier substrate.

4. The light-emitting structure of claim 1, wherein the metal units are disposed in an array arrangement on the carrier substrate.

5. The light-emitting structure of claim 1, wherein the first electrical metal is positive, and the second electrical metal is negative.

6. The light-emitting structure of claim 1, wherein the light emitter is a III-nitride semiconductor light-emitting stacked layer.

7. The light-emitting structure of claim 1, wherein the light emitter further comprises a rough surface at one side thereof opposite to the first electrical metal and the second electrical metal.

8. The light-emitting structure of claim 1, wherein the carrier substrate is a silicon substrate or a highly heat-conductive ceramic substrate made of aluminum nitride (AlN) or boron nitride (BN).

9. The light-emitting structure of claim 1 further comprising a transparent growth substrate disposed at one side of the light emitter opposite to the first electrical metal and the second electrical metal.