Rotating rectifier assembly bus bar
First Claim
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1. A rectifier assembly comprising:
- a diode pack;
a bus bar including a first layer electrically connected to the diode pack, the first layer having a first yield strength and a first coefficient of thermal expansion, and a second layer of copper joined to and in engagement with the first layer along a length and including second yield strength less than the first yield strength, wherein the first layer is beryllium copper, wherein the second layer is either brazed or adhered to the first layer, wherein the second layer is secured to one side of the first layer, wherein the second layer surrounds a perimeter of the first layer.
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Abstract
A rectifier assembly includes a diode pack. A bus bar includes a first layer electrically connected to the diode pack. The first layer has a first yield strength and a first coefficient of thermal expansion. A second layer of copper is joined to the first layer and includes a second yield strength less than the first yield strength. In one example, the second layer has a second coefficient of thermal expansion within 5% of the first coefficient of thermal expansion.
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15 Claims
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1. A rectifier assembly comprising:
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a diode pack; a bus bar including a first layer electrically connected to the diode pack, the first layer having a first yield strength and a first coefficient of thermal expansion, and a second layer of copper joined to and in engagement with the first layer along a length and including second yield strength less than the first yield strength, wherein the first layer is beryllium copper, wherein the second layer is either brazed or adhered to the first layer, wherein the second layer is secured to one side of the first layer, wherein the second layer surrounds a perimeter of the first layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A bus bar comprising:
a first layer electrically connected to a diode pack, the first layer having a first yield strength and a first coefficient of thermal expansion, and a second layer of copper joined to and in engagement with the first layer along a length and including second yield strength less than the first yield strength and a second coefficient of thermal expansion within 5% of the first coefficient of thermal expansion, wherein the second layer surrounds a perimeter of the first layer and arranged as a rotor winding. - View Dependent Claims (11, 12, 13, 14, 15)
Specification