PoP structures including through-assembly via modules
First Claim
1. A device comprising:
- a first package component;
a first plurality of metal posts at a bottom surface of the first package component and electrically coupled to the first package component;
a Through-Assembly Via (TAV) Module comprising;
a substrate;
a strip-shaped via in the substrate, wherein the strip-shaped via is electrically floating;
a plurality of through-vias penetrating through the substrate, wherein each of the plurality of through-vias comprises a straight sidewall extending from a top surface to a bottom surface of the substrate; and
a second plurality of metal posts at a bottom surface of the TAV module and electrically coupled to the plurality of through-vias;
a polymer comprising;
a first portion between and contacting sidewalls of the first package component and the TAV module;
a second portion disposed between the first plurality of metal posts; and
a third portion disposed between the second plurality of metal posts;
a first plurality of Redistribution Lines (RDLs) underlying a bottom surface of the second and the third portions of the polymer; and
a second plurality of RDLs over the first package component and the TAV module, wherein the first plurality of RDLs is electrically coupled to the second plurality of RDLs through the plurality of through-vias in the TAV module.
1 Assignment
0 Petitions
Accused Products
Abstract
A device includes a Through-Assembly Via (TAV) Module, which includes a substrate, a plurality of through-vias penetrating through the substrate, and a second plurality of metal posts at a bottom surface of the TAV module and electrically coupled to the plurality of through-vias. A polymer includes a first portion between and contacting sidewalls of the first package component and the TAV module, a second portion disposed between the first plurality of metal posts, and a third portion disposed between the second plurality of metal posts. A first plurality of Redistribution Lines (RDLs) is underlying a bottom surface of the second and the third portions of the polymer. A second plurality of RDLs is over the first package component and the TAV module. The first plurality of RDLs is electrically coupled to the second plurality of RDLs through the plurality of through-vias in the TAV module.
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Citations
18 Claims
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1. A device comprising:
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a first package component; a first plurality of metal posts at a bottom surface of the first package component and electrically coupled to the first package component; a Through-Assembly Via (TAV) Module comprising; a substrate; a strip-shaped via in the substrate, wherein the strip-shaped via is electrically floating; a plurality of through-vias penetrating through the substrate, wherein each of the plurality of through-vias comprises a straight sidewall extending from a top surface to a bottom surface of the substrate; and a second plurality of metal posts at a bottom surface of the TAV module and electrically coupled to the plurality of through-vias; a polymer comprising; a first portion between and contacting sidewalls of the first package component and the TAV module; a second portion disposed between the first plurality of metal posts; and a third portion disposed between the second plurality of metal posts; a first plurality of Redistribution Lines (RDLs) underlying a bottom surface of the second and the third portions of the polymer; and a second plurality of RDLs over the first package component and the TAV module, wherein the first plurality of RDLs is electrically coupled to the second plurality of RDLs through the plurality of through-vias in the TAV module. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A device comprising:
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a bottom package comprising; a package substrate; a plurality of connectors over the package substrate; a package comprising; a device die; a Through-Assembly Via (TAV) module substantially level with the device die, wherein the TAV module is free from active devices therein, and wherein the TAV module comprises a substrate and a plurality of through-vias penetrating through the substrate, wherein the plurality of through-vias comprises strip-shaped vias, with alternating ones of the strip-shaped vias interconnected to form capacitor plates of a capacitor; and a molding compound contacting a bottom surface of the device die, a bottom surface of the TAV module, and sidewalls of the device die and the TAV module; and a first plurality of Redistribution Lines (RDLs) under the molding compound and electrically coupled to the device die and the plurality of through-vias in the TAV module, wherein the first plurality of RDLs is bonded to the package substrate through the plurality of connectors; and a top package component bonded to the bottom package. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A device comprising:
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a package comprising; a device die; a Through-Assembly Via (TAV) module free from active devices and passive devices therein, wherein the TAV module comprises a first substrate and a plurality of through-vias penetrating through the first substrate, wherein the plurality of through-vias further comprises; a first plurality of through-vias interconnected to form a first capacitor plate of a capacitor; and a second plurality of through-vias interconnected to form a second capacitor plate of the capacitor; and a molding compound encircling each of the device die and the TAV module; and a first plurality of Redistribution Lines (RDLs) and a second plurality of RDLs electrically coupled to the plurality of through-vias, wherein the first plurality of RDLs and the second plurality of RDLs are on opposite sides of the plurality of through-vias. - View Dependent Claims (15, 16, 17, 18)
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Specification