Micromirror array assembly

• US 9,261,696 B2
• Filed: 04/08/2014
• Issued: 02/16/2016
• Est. Priority Date: 06/15/2004
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Patel, Satyadev, Huibers, Andrew G., Richards, Peter, Tarn, Terry, Dehlinger, Dietrich
• Primary Examiner(s): Dinh, Jack
• Application Number:
  US14/247,304
• Publication Number:
  US 20140299653A1
• Time in Patent Office: 679 Days
• Field of Search: 359/290, 359/291, 359/295, 359/298, 359/900
• US Class Current: 1/1
• CPC Class Codes: B81C 3/001 Bonding of two components
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: Y10S 359/90 Methods
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.

Claims

1. A method of forming a microelectromechanical system (MEMS) device, the method comprising:

providing a MEMS structure on a first substrate;

providing a second substrate; and

hermetically bonding the first substrate and the second substrate together to form an assembly such that the MEMS structure is positioned between the substrates;

wherein the step of bonding the first substrate and the second substrate further includes;

forming a first sealing ring on the first substrate;

forming a second sealing ring on the second substrate; and

bonding the first sealing ring to the second sealing ring to hermetically bond the first substrate and the second substrate with the bonded sealing rings circumferentially surrounding the MEMS structure;

wherein the first sealing ring comprises a first layer of material deposited on the first substrate, and at least one layer of metallic material deposited over the first layer of material;

wherein the second sealing ring comprises a first layer of material deposited on the second substrate, and at least one layer of metallic material deposited over the first layer of material; and

wherein bonding the first sealing ring to the second sealing ring comprises melting at least one of the metallic layers of the at least one of the first and second sealing rings.

2. The method of claim 1, further comprising forming a trench perimetrically of the MEMS structure inside the first sealing ring on the first substrate.

3. The method of claim 2, further comprising forming at least one of a getter or lubricant material within the trench.

4. The method of claim 1, further comprising depositing a curable material perimetrically of the MEMS structure on one or both substrates, outside the bonded sealing rings, and curing the material between and in contact with the first and second substrates.

5. The method of claim 4, wherein the curable material is epoxy.

6. A method of forming a microelectromechanical system (MEMS) device, the method comprising:

forming a plurality of MEMS elements on a first substrate;

providing a second substrate; and

hermetically bonding the first substrate and the second substrate together to form an assembly such that the MEMS elements are positioned between the substrates;

wherein the step of bonding the first substrate and the second substrate further includes;

forming a first sealing ring on the first substrate;

forming a second sealing ring on the second substrate; and

bonding the first sealing ring to the second sealing ring to hermetically bond the first substrate and the second substrate with the bonded sealing rings circumferentially surrounding the MEMS elements;

wherein the first sealing ring comprises a first layer of material deposited on the first substrate, and at least one layer of metallic material deposited over the first layer of material;

wherein the second sealing ring comprises a first layer of material deposited on the second substrate, and at least one layer of metallic material deposited over the first layer of material; and

wherein bonding the first sealing ring to the second sealing ring comprises melting at least one of the metallic layers of the at least one of the first and second sealing rings.

7. The method of claim 6, further comprising forming a trench perimetrically of the MEMS elements inside the first sealing ring on the first substrate.

8. The method of claim 7, further comprising depositing a curable material perimetrically of the MEMS elements on one of the first and second substrates, outside the bonded sealing ring formed on that surface, and curing the material between and in contact with the first and second substrates.

9. The method of claim 8, wherein the MEMS device is a spatial light modulator for use in a display system and the MEMS elements are micromirrors.