Micromirror array assembly
First Claim
1. A method of forming a microelectromechanical system (MEMS) device, the method comprising:
- providing a MEMS structure on a first substrate;
providing a second substrate; and
hermetically bonding the first substrate and the second substrate together to form an assembly such that the MEMS structure is positioned between the substrates;
wherein the step of bonding the first substrate and the second substrate further includes;
forming a first sealing ring on the first substrate;
forming a second sealing ring on the second substrate; and
bonding the first sealing ring to the second sealing ring to hermetically bond the first substrate and the second substrate with the bonded sealing rings circumferentially surrounding the MEMS structure;
wherein the first sealing ring comprises a first layer of material deposited on the first substrate, and at least one layer of metallic material deposited over the first layer of material;
wherein the second sealing ring comprises a first layer of material deposited on the second substrate, and at least one layer of metallic material deposited over the first layer of material; and
wherein bonding the first sealing ring to the second sealing ring comprises melting at least one of the metallic layers of the at least one of the first and second sealing rings.
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Abstract
The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.
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Citations
9 Claims
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1. A method of forming a microelectromechanical system (MEMS) device, the method comprising:
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providing a MEMS structure on a first substrate; providing a second substrate; and hermetically bonding the first substrate and the second substrate together to form an assembly such that the MEMS structure is positioned between the substrates; wherein the step of bonding the first substrate and the second substrate further includes; forming a first sealing ring on the first substrate; forming a second sealing ring on the second substrate; and bonding the first sealing ring to the second sealing ring to hermetically bond the first substrate and the second substrate with the bonded sealing rings circumferentially surrounding the MEMS structure; wherein the first sealing ring comprises a first layer of material deposited on the first substrate, and at least one layer of metallic material deposited over the first layer of material; wherein the second sealing ring comprises a first layer of material deposited on the second substrate, and at least one layer of metallic material deposited over the first layer of material; and wherein bonding the first sealing ring to the second sealing ring comprises melting at least one of the metallic layers of the at least one of the first and second sealing rings. - View Dependent Claims (2, 3, 4, 5)
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6. A method of forming a microelectromechanical system (MEMS) device, the method comprising:
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forming a plurality of MEMS elements on a first substrate; providing a second substrate; and hermetically bonding the first substrate and the second substrate together to form an assembly such that the MEMS elements are positioned between the substrates; wherein the step of bonding the first substrate and the second substrate further includes; forming a first sealing ring on the first substrate; forming a second sealing ring on the second substrate; and bonding the first sealing ring to the second sealing ring to hermetically bond the first substrate and the second substrate with the bonded sealing rings circumferentially surrounding the MEMS elements; wherein the first sealing ring comprises a first layer of material deposited on the first substrate, and at least one layer of metallic material deposited over the first layer of material; wherein the second sealing ring comprises a first layer of material deposited on the second substrate, and at least one layer of metallic material deposited over the first layer of material; and wherein bonding the first sealing ring to the second sealing ring comprises melting at least one of the metallic layers of the at least one of the first and second sealing rings. - View Dependent Claims (7, 8, 9)
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Specification