Electronic signal transmitting device and integrated circuit thereof

• US 9,263,355 B2
• Filed: 09/11/2013
• Issued: 02/16/2016
• Est. Priority Date: 07/02/2013
• Status: Active Grant

• Current Assignee: Wistron Corporation
• Original Assignee: Wistron Corporation
• Inventors: Tuen, Lung-Fai, Lin, Wei-Cheng, Weng, Chi-Fang, Lee, Hong-Kuei, Chang, Wei-Shuen, Chu, Wei-Shen
• Primary Examiner(s): Haughton, Anthony
• Assistant Examiner(s): Gafur, Razmeen
• Application Number:
  US14/023,471
• Publication Number:
  US 20150009630A1
• Time in Patent Office: 888 Days
• Field of Search: 361676-678, 36167946-67954, 361688-723, 165 801- 805, 165/104.33, 165/185, 174 151- 153, 174 161- 163, 174/547, 174/548, 257712-722, 257/E23.088, 244/53, 24458-459, 454/184, 312/236
• US Class Current: 1/1
• CPC Class Codes: H01F 27/02 Casings
• CPC Class Codes: H01F 27/34 Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
• CPC Class Codes: H01L 23/00 Details of semiconductor or other solid state devices H01L25/00 takes precedence ; structural arrangements for testing or measuring during manufacture or treatment, or for reliability measurements H01L22/00; arrangements for connecting or disconnecting semiconductor or solid-state bodies, or methods related thereto H01L24/00; finger print sensors G06V40/12
• CPC Class Codes: H01L 23/60 Protection against electrostatic charges or discharges, e.g. Faraday shields
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An electronic signal transmitting device is disposed in a housing of an integrated circuit. The integrated circuit includes at least one first signal end and at least one second signal end. The electronic signal transmitting device includes at least one electromagnetic transmitting unit, coupled between the first signal end and the second signal end for transmitting an electronic signal between the first signal end and the second signal end; and an electromagnetic insulating layer covering the electromagnetic transmitting unit for protecting the integrated circuit from electromagnetic interference.

Claims

1. An electronic signal transmitting device disposed in a housing of an integrated circuit, the integrated circuit comprising at least one first signal end and at least one second signal end, the electronic signal transmitting device comprising:

at least one electromagnetic transmitting unit, coupled between the first signal end and the second signal end for transmitting an electronic signal between the first signal end and the second signal end;

an electromagnetic insulating layer covering the electromagnetic transmitting unit for protecting the integrated circuit from electromagnetic interference; and

an electromagnetic heat-conducting layer configured in the housing of the integrated circuit, the electromagnetic heat-conducting layer being stacked on the electromagnetic insulating layer and coupled to at least one cooling hole of the housing.

2. The electronic signal transmitting device of claim 1, wherein the electromagnetic transmitting unit comprises:

a magnetizer; and

a magnetic coil twining round the magnetizer and coupled to one of the first signal end and one of the second signal end.

3. The electronic signal transmitting device of claim 2, wherein the electromagnetic transmitting unit further comprises:

a waveform filter unit, electrically connected between one of the first signal ends and the magnetic coil for filtering noise of electronic signals.

4. The electronic signal transmitting device of claim 2, wherein the electromagnetic transmitting unit further comprises:

an electronic signal transmitting capacitor, electrically coupled between one of the first signal end and one of the second signal end.

5. The electronic signal transmitting device of claim 1, wherein the electromagnetic insulating layer is a varnish layer.

6. The electronic signal transmitting device of claim 1, wherein the electromagnetic heat-conducting layer is a thermal grease layer.

7. An integrated circuit, comprising:

a housing;

at least one first signal end, configured at a first side of the housing;

at least one second signal end, configured at a second side of the housing; and

an electronic signal transmitting unit, configured in the housing, comprising;

at least one electromagnetic transmitting unit, coupled between the first signal end and the second signal end, for transmitting an electronic signal between the first signal end and the second signal end; and

an electromagnetic insulating layer covering the electromagnetic transmitting unit for protecting the integrated circuit from electromagnetic interference; and

an electromagnetic heat-conducting layer configured in the housing of the integrated circuit, the electromagnetic heat-conducting layer being stacked on the electromagnetic insulating layer and coupled to at least one cooling hole of the housing.

8. The integrated circuit of claim 7, wherein the electromagnetic transmitting unit comprises:

a magnetizer; and

a magnetic coil twining round the magnetizer and coupled to one of the first signal end and one of the second signal end.

9. The integrated circuit of claim 8, wherein the electromagnetic transmitting unit further comprises:

a waveform filter unit, electrically connected between one of the first signal end and the magnetic coil for filtering noise of electronic signals.

10. The integrated circuit of claim 8, wherein the electromagnetic transmitting unit further comprises:

an electronic signal transmitting capacitor, electrically coupled between one of the first signal end and one of the second signal end.

11. The integrated circuit of claim 7, wherein the electromagnetic insulating layer is a varnish layer.

12. The integrated circuit of claim 7, wherein the electromagnetic heat-conducting layer is a thermal grease layer.