Through substrate via structures and methods of forming the same
First Claim
1. A structure comprising:
- a substrate;
an interconnect structure over the substrate;
a through-substrate-via (TSV) extending through the interconnect structure and into the substrate, the TSV comprising a conductive material layer;
a metal layer over the interconnect structure, wherein a top surface of the metal layer is substantially level with a top surface of the TSV; and
a dielectric layer having a first portion over the interconnect structure and a second portion within the TSV, wherein the first portion and the second portion comprise a same material,wherein the conductive material layer comprises;
a first section separated from substrate by the second portion of the dielectric layer,a second section over a top surface of the second portion of the dielectric layer, anda third section over the second section, wherein the third section has a width greater than a width of the second section.
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Accused Products
Abstract
A structure includes a substrate, and an interconnect structure over the substrate. The structure further includes a through-substrate-via (TSV) extending through the interconnect structure and into the substrate, the TSV comprising a conductive material layer. The structure further includes a dielectric layer having a first portion over the interconnect structure and a second portion within the TSV, wherein the first portion and the second portion comprise a same material. The conductive material layer includes a first section separated from substrate by the second portion of the dielectric layer. The conductive material layer further includes a second section over a top surface of the second portion of the dielectric layer. The conductive material layer further includes a third section over the second section, wherein the third section has a width greater than a width of the second section.
48 Citations
20 Claims
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1. A structure comprising:
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a substrate; an interconnect structure over the substrate; a through-substrate-via (TSV) extending through the interconnect structure and into the substrate, the TSV comprising a conductive material layer; a metal layer over the interconnect structure, wherein a top surface of the metal layer is substantially level with a top surface of the TSV; and a dielectric layer having a first portion over the interconnect structure and a second portion within the TSV, wherein the first portion and the second portion comprise a same material, wherein the conductive material layer comprises; a first section separated from substrate by the second portion of the dielectric layer, a second section over a top surface of the second portion of the dielectric layer, and a third section over the second section, wherein the third section has a width greater than a width of the second section. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A structure comprising:
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a substrate; an isolation structure in the substrate; a through-substrate-via (TSV) extending through the isolation structure and into the substrate, wherein a bottom surface of the TSV is below a bottom surface of the isolation structure; a dielectric layer having a first portion over the substrate and a second portion within the TSV, wherein the first portion and the second portion comprise a same material, a top surface of the second portion is above the isolation structure, and the second portion of the dielectric layer contacts the isolation structure, and wherein the TSV extends over the top surface of the second portion of the dielectric layer. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method of forming a structure, the method comprising:
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forming a through-substrate-via (TSV) opening in a substrate, wherein the substrate comprises an isolation structure, and the TSV opening extends through the isolation structure; depositing a dielectric layer on the substrate, wherein the dielectric layer lines the TSV opening, patterning and etching the dielectric layer to form a wider opening at one end of the TSV opening in a first portion of the dielectric layer, and to define a second portion of the dielectric layer in the TSV opening, filling the TSV opening with a conductive material layer, wherein the conductive material layer in the TSV opening extends over a top surface of the second portion of the dielectric layer closest to the first portion of the dielectric layer; and removing the conductive material layer outside the wider opening, wherein removing the conductive material outside the wider opening comprises maintaining the first portion of the dielectric layer. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification