Managing method of building material and wireless chip applied to the method

• US 9,263,404 B2
• Filed: 02/05/2014
• Issued: 02/16/2016
• Est. Priority Date: 04/19/2005
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Asami, Yoshinobu
• Primary Examiner(s): Ali, Mohammad
• Assistant Examiner(s): Rao, Sheela S
• Application Number:
  US14/173,378
• Publication Number:
  US 20140151861A1
• Time in Patent Office: 741 Days
• Field of Search: 700/116, 700/121, 235/492, 257/664, 257/778, 283/81, 283/82, 283/83, 156/47, 285/81
• US Class Current: 1/1
• CPC Class Codes: G06Q 10/06 Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
• CPC Class Codes: H01L 21/00 Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A lot of buildings have been built while it is concerned that a building material is used fraudulently. Therefore, the present invention provides a managing method of the material and a system thereof. The present invention provides a managing method including a step of attaching a sheet including a plurality of memories to each surface of a plurality of materials, a step of dividing the plurality of materials with the sheet in accordance with data in the memory, a step of constructing a building by using the divided material in accordance with the data in the memory, and a step of checking the data on the constructed building, which is stored in the plurality of memories.

Claims

1. A wireless chip comprising:

an adhesive layer having a first portion and a second portion over a material, wherein a bottom surface of the first portion and a bottom surface of the second portion are in contact with the material;

a barrier layer over the adhesive layer, the barrier layer is in contact with a top surface of the first portion and a top surface of the second portion;

a sheet including a plurality of wireless chips attached to the material via the adhesive layer and the barrier layer, each of the plurality of wireless chips comprising an integrated circuit portion; and

an antenna configured to supply power to the integrated circuit portion,

wherein the first portion and a first wireless chip of the plurality of wireless chips overlap each other,

wherein the second portion and a region between the first wireless chip and a second wireless chip of the plurality of wireless chips adjacent to the first wireless chip overlap each other, and

wherein adhesive intensity of the first portion is higher than adhesive intensity of the second portion.

2. The wireless chip according to claim 1, further comprising:

a protective layer over the adhesive layer.

3. The wireless chip according to claim 1, wherein the wireless chip includes a plurality of memories.

4. The wireless chip according to claim 1, wherein the integrated circuit portion is configured to store data on the material.

5. The wireless chip according to claim 1,

wherein the adhesive layer further has a third portion,

wherein a bottom surface of the third portion is in contact with the material,

wherein the barrier layer is in contact with a top surface of the third portion,

wherein the third portion and a region between the first wireless chip and a third wireless chip of the plurality of wireless chips adjacent to the first wireless chip overlap each other, and

wherein the adhesive intensity of the first portion is higher than adhesive intensity of the third portion.

6. A wireless chip comprising:

an adhesive layer having a first portion and a second portion over a material, wherein a bottom surface of the first portion and a bottom surface of the second portion are in contact with the material;

a barrier layer over the adhesive layer, the barrier layer is in contact with a top surface of the first portion and a top surface of the second portion;

a sheet including a plurality of wireless chips attached to the material via the adhesive layer and the barrier layer, each of the plurality of wireless chips comprising an integrated circuit portion; and

an antenna configured to supply power to the integrated circuit portion,

wherein the first portion and a first wireless chip of the plurality of wireless chips overlap each other,

wherein an edge of the second portion and the first wireless chip overlap each other,

wherein the second portion and a region between the first wireless chip and a second wireless chip of the plurality of wireless chips adjacent to the first wireless chip overlap each other, and

wherein adhesive intensity of the first portion is higher than adhesive intensity of the second portion.

7. The wireless chip according to claim 6, further comprising:

a protective layer over the adhesive layer.

8. The wireless chip according to claim 6, wherein the wireless chip includes a plurality of memories.

9. The wireless chip according to claim 6, wherein the integrated circuit portion is configured to store data on the material.

10. The wireless chip according to claim 6,

wherein the adhesive layer further has a third portion,

wherein a bottom surface of the third portion is in contact with the material,

wherein the barrier layer is in contact with a top surface of the third portion,

wherein the third portion and a region between the first wireless chip and a third wireless chip of the plurality of wireless chips adjacent to the first wireless chip overlap each other,

wherein an edge of the third portion and the first wireless chip overlap each other, and

wherein the adhesive intensity of the first portion is higher than adhesive intensity of the third portion.

11. A semiconductor device comprising:

an adhesive layer having a first portion and a second portion, the adhesive layer configured to attach to a material, wherein a bottom surface of the first portion and a bottom surface of the second portion are in contact with the material; and

a sheet in contact with a top surface of the first portion and a top surface of the second portion, the sheet including a first wireless chip and a second wireless chip adjacent to the first wireless chip,

wherein the first portion and the first wireless chip overlap each other,

wherein the second portion and a region between the first wireless chip and the second wireless chip overlap each other, and

wherein adhesive intensity of the first portion is higher than adhesive intensity of the second portion.

12. The semiconductor device according to claim 11, further comprising:

a barrier layer between the adhesive layer and the sheet.

13. The semiconductor device according to claim 11, further comprising:

a protective layer over the adhesive layer.

14. The semiconductor device according to claim 11,

wherein the first wireless chip comprising a memory and an integrated circuit portion, and

wherein the integrated circuit portion is configured to store data on the material.

15. The semiconductor device according to claim 11, wherein the second portion is configured to be peeled off by power to peel off the sheet from the material, and the first portion is configured to remain to attach to the material by the power.

16. The semiconductor device according to claim 11,

wherein the adhesive layer further has a third portion,

wherein a bottom surface of the third portion is in contact with the material,

wherein the sheet is in contact with a top surface of the third portion,

wherein the sheet further includes a third wireless chip adjacent to the first wireless chip,

wherein the third portion and a region between the first wireless chip and the third wireless chip overlap each other, and

wherein the adhesive intensity of the first portion is higher adhesive intensity of the third portion.