Semiconductor device with vertically inhomogeneous heavy metal doping profile
First Claim
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1. A semiconductor device having a thickness L comprising:
- a p-doped region;
an n-doped region; and
a vertically inhomogeneous heavy metal doping profile comprising a first heavy metal doping concentration greater than C1 across a first depth region of a thickness greater than L/6 and a second heavy metal doping concentration smaller than C2 across a second depth region of a thickness greater than L/6, wherein C1>
3×
C2, andwherein the semiconductor device is a PIN diode.
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Abstract
Method of producing a vertically inhomogeneous platinum or gold distribution in a semiconductor substrate with a first and a second surface opposite the first surface, with diffusing platinum or gold into the semiconductor substrate from one of the first and second surfaces of the semiconductor substrate, removing platinum- or gold-comprising residues remaining on the one of the first and second surfaces after diffusing the platinum or gold, forming a phosphorus- or boron-doped surface barrier layer on the first or second surface, and heating the semiconductor substrate for local gettering of the platinum or gold by the phosphorus- or boron-doped surface barrier layer.
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Citations
7 Claims
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1. A semiconductor device having a thickness L comprising:
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a p-doped region; an n-doped region; and a vertically inhomogeneous heavy metal doping profile comprising a first heavy metal doping concentration greater than C1 across a first depth region of a thickness greater than L/6 and a second heavy metal doping concentration smaller than C2 across a second depth region of a thickness greater than L/6, wherein C1>
3×
C2, andwherein the semiconductor device is a PIN diode. - View Dependent Claims (2, 3, 4, 5)
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6. A semiconductor device having a thickness L comprising:
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a p-doped region; an n-doped region; and a vertically inhomogeneous heavy metal doping profile comprising a first heavy metal doping concentration greater than C1 across a first depth region of a thickness greater than L/6 and a second heavy metal doping concentration smaller than C2 across a second depth region of a thickness greater than L/6, wherein C1>
3×
C2,wherein the semiconductor device is an insulated-gate bipolar transistor (IGBT) or a reverse-conducting insulated-gate bipolar transistor (RC-IGBT) with an integrated diode.
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7. A semiconductor device having a thickness L comprising:
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a p-doped region; an n-doped region; and a vertically inhomogeneous heavy metal doping profile comprising a first heavy metal doping concentration greater than C1 across a first depth region of a thickness greater than L/6 and a second heavy metal doping concentration smaller than C2 across a second depth region of a thickness greater than L/6, wherein C1>
3×
C2,wherein the semiconductor device is a double-diffused metal-oxide semiconductor (DMOS) transistor.
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Specification