Method for manufacturing MTJ memory device
First Claim
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1. A method of manufacturing a magnetic tunnel junction (“
- MTJ”
) device, the method comprising;
depositing a plurality of MTJ layers on a substrate wafer, the plurality of MTJ layers including a reference layer, a barrier layer disposed on the reference layer and a free layer disposed on the barrier layer;
depositing a hard mask above the plurality of MTJ layers;
forming a first photoresist layer on a portion of the hard mask;
etching the hard mask and the plurality of MTJ layers to form an MTJ pillar under the first photoresist layer, wherein the free layer and barrier layer are etched to expose side surfaces of the free layer and the barrier layer and a surface of the reference layer adjacent to the MTJ structure;
depositing a first insulating layer on the MTJ pillar, on the exposed side surfaces of the free layer and the barrier layer, and on the exposed surface of the reference layer;
ion beam etching the MTJ pillar to remove a portion of the first insulating layer that is disposed on horizontal surfaces of the MTJ pillar and the exposed surface of the reference layer;
etching the MTJ layers to the substrate wafer to electrically isolate the MTJ pillar from adjacent MTJ pillars;
andplanarizing the substrate wafer,wherein the step of etching the MTJ layers includes at least one reactive ion etching and at least one ion beam etching.
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Abstract
A method for manufacturing MTJ pillars for a MTJ memory device. The method includes depositing multiple MTJ layers on a substrate, depositing a hard mask on the substrate and coating a photoresist on the hard mask. Further, alternating steps of reactive ion etching and ion beam etching are performed to isolate MTJ pillars and expose side surfaces of the MTJ layers. An insulating layer is the applied to protect the side surfaces of the MTJ layers. A second insulating layer is deposited before the device is planarized using chemical mechanical polishing.
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Citations
20 Claims
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1. A method of manufacturing a magnetic tunnel junction (“
- MTJ”
) device, the method comprising;depositing a plurality of MTJ layers on a substrate wafer, the plurality of MTJ layers including a reference layer, a barrier layer disposed on the reference layer and a free layer disposed on the barrier layer; depositing a hard mask above the plurality of MTJ layers; forming a first photoresist layer on a portion of the hard mask; etching the hard mask and the plurality of MTJ layers to form an MTJ pillar under the first photoresist layer, wherein the free layer and barrier layer are etched to expose side surfaces of the free layer and the barrier layer and a surface of the reference layer adjacent to the MTJ structure; depositing a first insulating layer on the MTJ pillar, on the exposed side surfaces of the free layer and the barrier layer, and on the exposed surface of the reference layer; ion beam etching the MTJ pillar to remove a portion of the first insulating layer that is disposed on horizontal surfaces of the MTJ pillar and the exposed surface of the reference layer; etching the MTJ layers to the substrate wafer to electrically isolate the MTJ pillar from adjacent MTJ pillars; and planarizing the substrate wafer, wherein the step of etching the MTJ layers includes at least one reactive ion etching and at least one ion beam etching. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
- MTJ”
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13. A method of manufacturing a magnetic tunnel junction (“
- MTJ”
) device, the method comprising;depositing at least one lower layer on a substrate wafer; depositing an anti-ferromagnetic layer on the at least one lower layer; depositing a synthetic antiferromagnetic structure on the anti-ferromagnetic layer, the synthetic antiferromagnetic structure including a reference layer; depositing a barrier layer on the reference layer; depositing a free layer on the barrier layer; depositing a tantalum nitride capping layer on the free layer; depositing at least one upper layer on the tantalum nitride capping layer; depositing a hard mask on the at least one upper layer; forming a first photoresist layer on a portion of the hard mask; reactive ion etching the hard mask; ion beam etching the at least one upper layer; reactive ion etching the tantalum nitride capping layer; ion beam etching the free layer and barrier layer to expose side surfaces of the free layer and barrier layer and a surface of the reference layer adjacent to the side surfaces of the barrier layer; depositing a first insulating layer on the MTJ pillar, on the exposed side surfaces of the free layer and the barrier layer, and on the exposed surface of the reference layer; ion beam etching at an angle normal relative to the substrate wafer to isolate at least one MTJ pillar; depositing a second insulating layer; and planarizing the substrate wafer. - View Dependent Claims (14, 15, 16, 17)
- MTJ”
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18. A method of manufacturing a magnetic tunnel junction (“
- MTJ”
) device, the method comprising;depositing a plurality of MTJ layers on a substrate wafer, the plurality of MTJ layers including a reference layer, a barrier layer disposed on the reference layer and a free layer disposed on the barrier layer; depositing a hard mask above the plurality of MTJ layers; forming a first photoresist layer on a portion of the hard mask; etching the hard mask and the plurality of MTJ layers to form an MTJ pillar under the first photoresist layer, wherein the free layer and barrier layer are etched to expose side surfaces of the free layer and barrier layer and a surface of the reference layer adjacent to the MTJ pillar; depositing a first insulating layer on the MTJ pillar, on the exposed side surfaces of the free layer and the barrier layer, and on the exposed surface of the reference layer; forming a second photoresist layer on the first insulating layer on the MTJ pillar and a portion of the exposed surface of the reference layer; ion beam etching at an angle normal relative to the substrate wafer to isolate the MTJ pillar; depositing a second insulating layer; and planarizing the substrate wafer. - View Dependent Claims (19)
- MTJ”
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20. A method of manufacturing a magnetic tunnel junction (“
- MTJ”
) device for a read head application, the method comprising;depositing a plurality of MTJ layers on a substrate wafer, the plurality of MTJ layers including a reference layer, a barrier layer disposed on the reference layer and a free layer disposed on the barrier layer; depositing a hard mask above the plurality of MTJ layers; forming a first photoresist layer on a portion of the hard mask; etching the hard mask and the plurality of MTJ layers to form an MTJ pillar under the first photoresist layer, wherein the free layer and barrier layer are etched to expose side surfaces of the free layer and barrier layer and a surface of the reference layer adjacent to the MTJ structure; depositing a first insulating layer on the MTJ pillar, on the exposed side surfaces of the free layer and the barrier layer, and on the exposed surface of the reference layer; ion beam etching the MTJ pillar to remove a portion of the first insulating layer that is disposed on horizontal surfaces of the MTJ pillar and the exposed surface of the reference layer; depositing a second insulating layer on the MTJ pillar; depositing a stabilizing magnetic layer on the second insulating layer; and planarizing the substrate wafer, wherein the etching step includes at least one reactive ion etching and at least one ion beam etching.
- MTJ”
Specification