Systems and methods for providing thermal fold-back to LED lights

• US 9,265,119 B2
• Filed: 06/17/2013
• Issued: 02/16/2016
• Est. Priority Date: 06/17/2013
• Status: Active Grant

• Current Assignee: LEDVANCE LLC (MLS Co. Ltd.)
• Original Assignee: TerraLUX Incorporated
• Inventors: Catalano, Anthony W., McDougle, Anthony N.
• Primary Examiner(s): Taningco, Alexander H
• Assistant Examiner(s): Garcia, Christian L
• Application Number:
  US13/919,742
• Publication Number:
  US 20140368130A1
• Time in Patent Office: 974 Days
• Field of Search: 315/309, 315/297, 315/307, 362/800, 362/276, 327/513
• US Class Current: 1/1
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 23/00 Arrangement of electric circuit elements in or on lighting devices characterised by cooling arrangements F21V29/508
• CPC Class Codes: H05B 45/56 involving measures to prevent abnormal temperature of the LEDs
• CPC Class Codes: Y02B 20/30 Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

In various embodiments, a module for providing thermal fold-back protection to an illumination device includes a housing, at least one temperature sensor, and thermal fold-back circuitry.

Claims

1. A module for providing thermal fold-back protection to an illumination device, the illumination device comprising (i) one or more light-emitting diodes (LEDs), (ii) driver circuitry for converting power received from an external source into a form usable by the LEDs, and (iii) a base receivable into a mating receptacle for at least one of a halogen light bulb, a fluorescent light bulb, or an incandescent light bulb, the illumination device lacking circuitry for decreasing current flow to an LED based on a temperature of the LED, the module comprising:

a housing comprising;

a module receptacle for receiving the base of the illumination device, and

a module base receivable into a mating receptacle for at least one of a halogen light bulb, a fluorescent light bulb, or an incandescent light bulb;

at least one temperature sensor for sensing a temperature of at least one of the LEDs of the illumination device; and

disposed within the housing, thermal fold-back circuitry configured for (i) electrical connection with the driver circuitry when the base of the illumination device is received within the module receptacle, and (ii) decreasing current flow to at least one of the LEDs of the illumination device based on the temperature sensed by the at least one temperature sensor,

wherein the module does not contain driver electronics for converting power received from an external source into a form usable by the LEDs of the illumination device.

2. The module of claim 1, wherein the temperature sensor is disposed on or within the housing.

3. The module of claim 1, wherein the temperature sensor is (i) external to the housing, (ii) mountable on the illumination device proximate at least one of the LEDs thereof, and (iii) configured for communication with the thermal fold-back circuitry.

4. The module of claim 3, further comprising at least one wire connecting the temperature sensor with the thermal fold-back circuitry.

5. The module of claim 3, wherein the thermal fold-back circuitry is configured to receive wireless communications from the thermal sensor.

6. The module of claim 1, wherein the temperature sensor comprises at least one of a thermistor, a thermocouple, or a resistance temperature detector.

7. The module of claim 1, wherein the module base and the base of the illumination device are of the same type selected from the group consisting of Edison screw bases, bayonet bases, and bi-pin bases.

8. The module of claim 1, wherein the module base and the base of the illumination device are of different types selected from the group consisting of Edison screw bases, bayonet bases, and bi-pin bases.

9. The module of claim 1, wherein (i) the driver circuitry is configured to supply a dimmed signal to the one or more LEDs in response to a signal from an external dimmer via phase dimming of an input voltage, and (ii) the thermal fold-back circuitry is configured to alter a phase angle of the dimmed signal based on the temperature sensed by the at least one temperature sensor.

10. The module of claim 1, wherein (i) the driver circuitry is configured to supply a fixed current to the one or more LEDs notwithstanding variations in an input voltage supplied to the illumination device, and (ii) the thermal fold-back circuitry is configured to dissipate current over a load in parallel with the one or more LEDs based on the temperature sensed by the at least one temperature sensor.

11. A method of retrofitting an illumination device to provide thermal fold-back protection, the illumination device comprising (i) one or more light-emitting diodes (LEDs), (ii) driver circuitry for converting power received from an external source into a form usable by the LEDs, and (iii) a base receivable into a mating receptacle for at least one of a halogen light bulb, a fluorescent light bulb, or an incandescent light bulb, the illumination device lacking circuitry for decreasing current flow to an LED based on a temperature of the LED, the method comprising:

providing a thermal fold-back module comprising (i) a housing comprising (a) a module receptacle for receiving the base of the illumination device, and (b) a module base receivable into a mating receptacle for at least one of a halogen light bulb, a fluorescent light bulb, or an incandescent light bulb, and (ii) disposed within the housing, thermal fold-back circuitry for decreasing current flow to at least one of the LEDs of the illumination device based on a temperature of at least one of the LEDs of the illumination device, wherein the module does not contain driver electronics for converting power received from an external source into a form usable by the LEDs of the illumination device;

receiving the base of the illumination device within the module receptacle, thereby electrically connecting the thermal fold-back circuitry and the driver circuitry such that, when the module base is received into the mating receptacle, power is conducted to the illumination device without conversion, within the module, into a form usable by the LEDs; and

disposing a temperature sensor proximate at least one of the LEDs of the illumination device.

12. The method of claim 11, further comprising receiving the module base within a mating receptacle (i) for at least one of a halogen light bulb, a fluorescent light bulb, or an incandescent light bulb and (ii) for supplying power to the illumination device.

13. The method of claim 11, wherein disposing the temperature sensor proximate at least one of the LEDs comprises placing the temperature sensor within or on an external housing of the illumination device, the temperature sensor being connected to the thermal fold-back circuitry by at least one wire.

14. The method of claim 11, wherein the temperature sensor is integrated with the module, the step of receiving the base of the illumination device within the module receptacle causing the temperature sensor to be disposed proximate at least one of the LEDS.

15. A module for providing thermal fold-back protection to an illumination device, the illumination device comprising (i) one or more light-emitting diodes (LEDs), (ii) driver circuitry for converting power received from an external source into a form usable by the LEDs, and (iii) a plurality of wires for connecting the illumination device to a mains voltage, the illumination device lacking circuitry for decreasing current flow to an LED based on a temperature of the LED, the module comprising:

a housing comprising;

a module receptacle for receiving the plurality of wires of the illumination device and

a module base comprising a plurality of wires connectable to a mains voltage;

at least one temperature sensor for sensing a temperature of at least one of the LEDs of the illumination device; and

disposed within the housing, thermal fold-back circuitry configured for (i) electrical connection with the driver circuitry when the plurality of wires of the illumination device are received within the module receptacle, and (ii) decreasing current flow to at least one of the LEDs of the illumination device based on the temperature sensed by the at least one temperature sensor,

wherein the module does not contain driver electronics for converting power received from an external source into a form usable by the LEDs of the illumination device.

16. The module of claim 15, wherein the temperature sensor is disposed on or within the housing.

17. The module of claim 15, wherein the temperature sensor is (i) external to the housing, (ii) mountable on the illumination device proximate at least one of the LEDs thereof, and (iii) configured for communication with the thermal fold-back circuitry.

18. The module of claim 17, further comprising at least one wire connecting the temperature sensor with the thermal fold-back circuitry.

19. The module of claim 15, wherein (i) the driver circuitry is configured to supply a dimmed signal to the one or more LEDs in response to a signal from an external dimmer via phase dimming of an input voltage, and (ii) the thermal fold-back circuitry is configured to alter a phase angle of the dimmed signal based on the temperature sensed by the at least one temperature sensor.

20. The module of claim 15, wherein (i) the driver circuitry is configured to supply a fixed current to the one or more LEDs notwithstanding variations in an input voltage supplied to the illumination device, and (ii) the thermal fold-back circuitry is configured to dissipate current over a load in parallel with the one or more LEDs based on the temperature sensed by the at least one temperature sensor.