×

Bonded abrasive article and method of grinding

  • US 9,266,219 B2
  • Filed: 12/30/2013
  • Issued: 02/23/2016
  • Est. Priority Date: 12/31/2012
  • Status: Active Grant
First Claim
Patent Images

1. An abrasive article configured to grind a tungsten carbide workpiece, the workpiece having a fracture toughness at least about 7 MPa·

  • m0.5, the abrasive article comprising;

    a body comprising abrasive particles contained within a bond material comprising a metal, wherein the body comprises a ratio of VAG/VBM of at least about 1.3, wherein VAG is a volume percent of abrasive particles within a total volume of the body and VBM is a volume percent of bond material within the total volume of the body,wherein the abrasive particles have an average particle size in a range of between about 20 to about 60 microns;

    wherein during a periphery insert grinding test operation of the abrasive article on at least one edge of the tungsten carbide workpiece, the edge of the tungsten carbide workpiece has a maximum chip size of less than about 0.0025 inches and the maximum chip size is at least 8% less than the maximum chip size achieved during a periphery insert grinding test operation of a conventional metal-bonded abrasive article on the at least one edge of the tungsten carbide workpiece; and

    wherein the periphery insert grinding test operation is conducted at a rough feed rate of 2 inches/min and a finish feed rate of 1.0 inches/min with the abrasive article operating at 8500 SFPM and a cut depth of 0.025 inches.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×