Case of electronic device having antenna pattern frame embedded therein, mold therefor and method of manufacturing thereof

• US 9,266,266 B2
• Filed: 05/03/2011
• Issued: 02/23/2016
• Est. Priority Date: 05/11/2010
• Status: Expired due to Fees

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Hong, Ha Ryong, Cho, Sung Eun, Chang, Ki Won, Han, Chang Mok, Lee, Dae Kyu, Jeon, Dae Seong, An, Chan Gwang, Sung, Jae Suk, Lee, Duk Woo
• Primary Examiner(s): Mikels, Matthew
• Application Number:
  US13/099,930
• Publication Number:
  US 20110279333A1
• Time in Patent Office: 1,757 Days
• Field of Search: 343/702, 343725-726, 343/741
• US Class Current: 1/1
• CPC Class Codes: B29C 2045/0049 the injected material flowing against a mould cavity protruding part
• CPC Class Codes: B29C 45/0046 Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
• CPC Class Codes: B29C 45/14065 Positioning or centering articles in the mould
• CPC Class Codes: B29C 45/14418 Sealing means between mould and article
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29C 45/14778 the article consisting of a material with particular properties, e.g. porous, brittle
• CPC Class Codes: B29C 45/14836 Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage B29C45/14434 takes precedence
• CPC Class Codes: B29C 45/1671 with an insert
• CPC Class Codes: B29L 2031/3431 Telephones, Earphones
• CPC Class Codes: B29L 2031/3437 Cellular phones
• CPC Class Codes: B29L 2031/3456 Antennas, e.g. radomes
• CPC Class Codes: B29L 2031/3481 Housings or casings incorporating or embedding electric or electronic elements
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 5/40 Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 9/0421 with a shorting wall or a shorting pin at one end of the element H01Q9/0414 takes precedence

Abstract

There is provided a case of an electronic device having an antenna pattern embedded therein, the case including: a radiator frame injection molded so that a radiator including an antenna pattern part and formed on a film is formed on one surface thereof; a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame.

Claims

1. A case of an electronic device having an antenna pattern embedded therein, the case comprising:

a radiator frame having a through hole, a radiator including an antenna pattern part disposed on a surface of the radiator frame, the antenna pattern part being apart from the through hole with a predetermined distance; and

a case frame covering the radiator frame such that the case frame is secured to the radiator frame via the through hole.

2. The case of claim 1, wherein the antenna pattern part includes a loop antenna wound around an outer portion of the through hole.

3. The case of claim 1, wherein the radiator frame and the case frame are integrally formed.

4. The case of claim 2, further comprising a through hole boundary groove formed at a boundary between the case frame and the through hole.

5. The case of claim 4, wherein the through hole boundary groove has an inclination, a depth of which becomes shallower in a direction from the through hole toward the case frame formed at an inner portion of the through hole.

6. The case of claim 1, further comprising an outer boundary groove formed at a boundary between an outer portion of the radiator frame and the radiator frame.

7. The case of claim 6, wherein the outer boundary groove has an inclination, a depth of which becomes shallower in a direction from the radiator frame toward the case frame formed at an outer portion of the radiator frame.

8. The case of claim 1, wherein the antenna pattern part includes an antenna coil wound multiple times so that a low frequency signal may be transmitted or received.

9. The case of claim 8, wherein the radiator frame includes an over-mold part covering a portion of each of adjacent antenna pattern parts.

10. The case of claim 8, wherein the radiator frame includes an over-mold part covering all antenna pattern parts adjacent thereto.

11. The case of claim 1, wherein the radiator includes a connection terminal part formed on one surface of the radiator frame, and the connection terminal part is injection molded to be exposed on a connection terminal support formed to protrude to an outer portion of the radiator frame.

12. The case of claim 9, wherein the connection terminal support includes an interconnection hole formed in a position corresponding to that of the connection terminal part.

13. The case of claim 1, wherein the radiator frame includes an outer jaw disposed to be higher than an upper surface of the radiator.

14. The case of claim 1, wherein the radiator includes at least two differently patterned antenna pattern parts.

15. The case of claim 1, wherein the film is made of a polymer plastic material containing a Cu component.

16. The case of claim 1, wherein the case frame is engaged with the radiator frame via the through hole via molding.

17. A case of an electronic device having an antenna pattern embedded therein, the case comprising:

a radiator frame injection molded so that a radiator including an antenna pattern part and formed on a film is formed on one surface thereof;

a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and

a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame,

wherein the radiator frame includes a through hole, and the through hole is inserted into an inner boundary jaw of a mold of the case of an electronic device through which the case frame is injection molded.

18. The case of claim 17, further comprising a through hole boundary groove formed at a boundary between the case frame and the through hole.

19. The case of claim 17, further comprising an outer boundary groove formed at a boundary between an outer portion of the radiator frame and the radiator frame.

20. A case of an electronic device having an antenna pattern embedded therein, the case comprising:

a radiator frame having a through hole, a radiator including an antenna pattern part disposed on a surface of the radiator frame, the antenna pattern part being apart from the through hole with a predetermined distance; and

a case frame covering the radiator frame and having a mold portion being inserted to the through hole so that the case frame is secured to the radiator frame.

21. A case of an electronic device, the case comprising:

a radiator frame comprising a through hole;

an antenna pattern disposed on the radiator frame so that the antenna pattern surrounds the through hole; and

a case frame attached to the radiator frame so that the antenna pattern is disposed between the radiator frame and the case frame;

wherein the case frame comprises a projection extending into the through hole; and

the projection comprises a boundary groove adjoining an edge of the through hole.