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Film deposition apparatus, substrate processing apparatus, film deposition method, and storage medium

  • US 9,267,204 B2
  • Filed: 08/28/2009
  • Issued: 02/23/2016
  • Est. Priority Date: 09/04/2008
  • Status: Active Grant
First Claim
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1. A film deposition apparatus comprising:

  • a turntable rotatably provided in a vacuum chamber and having an upper surface with a plurality of substrate receiving parts each configured to receive a corresponding one of a plurality of substrates;

    a first reaction gas supply part and a second reaction gas supply part, extending from mutually different positions along a circumferential edge of the turntable towards a rotation center of the turntable, configured to supply the first reaction gas and the second reaction gas, respectively;

    a first separation gas supply part extending from a position along the circumferential edge of the turntable between the first reaction gas supply part and the second reaction gas supply part towards the rotation center of the turntable, configured to supply a first separation gas for separating the first reaction gas and the second reaction gas from each other;

    a protection top plate, having a lower surface opposing the upper surface of the turntable, and configured to protect the vacuum chamber against corrosion from the first reaction gas and the second reaction gas;

    a first lower surface portion located at a first distance from the upper surface of the turntable, and included in the lower surface of the protection top plate which includes the first reaction gas supply part, to thereby form a first space between the first lower surface portion and the turntable;

    a second lower surface portion located at a second distance from the upper surface of the turntable at a position separated from the first lower surface portion, and included in the lower surface of the protection top plate which includes the second reaction gas supply part, to thereby form a second space between the second lower surface portion and the turntable;

    a third lower surface portion located at a third distance from the upper surface of the turntable, and included in the lower surface of the protection top plate which includes the first separation gas supply part and is located on both sides of the first separation gas supply part along a rotating direction of the turntable, to thereby form a third space between the third lower surface portion and the turntable, said third distance being shorter than each of the first distance and the second distance, and said third space having the third distance to flow the first separation gas from the first separation gas supply part to the first space and the second space;

    a vacuum chamber protection part configured to surround the turntable, the first space, the second space and the third space, together with the protection top plate, and protect the vacuum chamber from corrosion with respect to the first reaction gas and the second reaction gas;

    a second separation gas supply part, provided in a central part area included in the lower surface of the protection top plate on a side of the plurality of substrate receiving parts relative to the rotation center of the turntable, and configured to supply a second separation gas for separating the first reaction gas and the second reaction gas from each other; and

    an exhaust port configured to exhaust the first reaction gas and the second reaction gas together with the first separation gas ejected to both sides of the third space and the second separation gas ejected from the central part area,wherein the third lower surface portion has a fan shape which increases in width from the rotation center towards the circumferential edge of the turntable on a plane parallel to the upper surface of the turntable,wherein a thin film is deposited on the plurality of substrates in the vacuum chamber by carrying out a supply cycle to sequentially supply at least two kinds of source gases, including the first reaction gas and the second reaction gas, by the first and second reaction gas supply parts,wherein each of the first, third, and second spaces forms a part of a continuous space formed between the lower surface of the protection top plate and the upper surface of the turntable, andwherein the continuous space has a ring shape that extends along a circumferential direction of the turntable about the rotation center in a plan view of the film deposition apparatus viewed from above the turntable in a direction perpendicular to the upper surface of the turntable, such that the first, third, and second spaces are arranged along the circumferential direction in the plan view and a distance of the lower surface of the protection top plate from the upper surface of the turntable varies along the circumferential direction.

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