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Bondline embedded current sensor

  • US 9,267,906 B2
  • Filed: 07/21/2014
  • Issued: 02/23/2016
  • Est. Priority Date: 04/12/2011
  • Status: Active Grant
First Claim
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1. A system for monitoring electrical current passing through a cured bondline of a bonded joint, the system comprising:

  • a current sensor network embedded in an adhesive layer of a cured bondline of a structural assembly, including;

    a plurality of inductive coils; and

    a plurality of current sensor nodes electrically interconnecting the inductive coils to form a plurality of current sensor loops generating induced current in response to a magnetic field associated with an electrical current passing through the adhesive layer, the current sensor nodes generating current signals representative of the induced current;

    a digital data communications network located external to the cured bondline and receiving the current signals from the current sensor nodes and detecting and monitoring electrical current passing through the cured bondline based on the current signals.

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