Thermal convection-type accelerometer

• US 9,267,961 B2
• Filed: 11/26/2012
• Issued: 02/23/2016
• Est. Priority Date: 11/29/2011
• Status: Expired due to Fees

• Current Assignee: Chung Hua University
• Original Assignee: Chung Hua University
• Inventors: Lin, Jium Ming
• Primary Examiner(s): Williams, Hezron E
• Assistant Examiner(s): Shabman, Mark A
• Application Number:
  US13/685,398
• Publication Number:
  US 20130133425A1
• Time in Patent Office: 1,184 Days
• Field of Search: 735/140.5, 735/140.9
• US Class Current: 1/1
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: C23C 16/487 using electron radiation
• CPC Class Codes: C23C 16/56 After-treatment
• CPC Class Codes: G01P 15/008 by using thermal pick-up
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A thermal convection-type accelerometer includes a first insulating substrate, a circuit formed on the first insulating substrate, a first acceleration-sensing device coupled with the circuit, and a first supporting layer attached on the insulating substrate. The first acceleration-sensing device includes two temperature-sensing components and a heater disposed between the temperature-sensing components. The temperature-sensing components and the heater are directly formed on the first supporting layer.

Claims

1. A thermal convection-type accelerometer, comprising:

a first insulating substrate;

a circuit formed on the first insulating substrate;

a first acceleration-sensing device coupled with the circuit, comprising two first temperature-sensing components and a first heater disposed between the two first temperature-sensing components;

wherein the first heater is in a presence of a noble gas configured to prevent oxidation;

a first supporting layer having a first side and a second side opposite to the first side, wherein the first insulating substrate is attached to the first side, and the support layer is configured to prevent the insulating substrate from contacting the noble gas; and

wherein the first acceleration-sensing device is attached to the second side.

2. The thermal convection-type accelerometer of claim 1, comprising two first acceleration-sensing devices, wherein the circuit comprises two connecting points, and two first temperature-sensing components on opposite sides relative to the first heaters and from the two first acceleration-sensing devices, respectively, connect to a same one of the two connecting points.

3. The thermal convection-type accelerometer of claim 2, further comprising two second acceleration-sensing devices, each comprising two second temperature-sensing components and a second heater disposed between the two second temperature-sensing components, wherein the first heater and the two first temperature-sensing components of each first acceleration-sensing device are arranged along a direction different from a direction along which the second heater and the two second temperature-sensing components of each second acceleration-sensing device are arranged.

4. The thermal convection-type accelerometer of claim 1, wherein the first insulating substrate comprises a plurality of contact pads, which are arranged along an edge of the first insulating substrate;

and the two first temperature-sensing components and the first heater are correspondingly coupled with the contact pads.

5. The thermal convection-type accelerometer of claim 1, further comprising:

a socket connector;

a plurality of terminals disposed in the socket connector, coupled with the circuit;

a second insulating substrate;

a plurality of contact pads arranged along an edge of the second insulating substrate, wherein the contact pads contact the terminals when the second insulating substrate is inserted into the socket connector;

a second acceleration-sensing device disposed on the second insulating substrate, comprising;

two second temperature-sensing components coupled with the contact pads; and

a second heater disposed between the two second temperature-sensing components, coupled with the contact pads; and

a second supporting layer attached to the second insulating substrate, wherein the second temperature-sensing components and the second heater are directly formed on the second supporting layer.

6. The thermal convection-type accelerometer of claim 5, comprising two second acceleration-sensing devices directly formed on the second insulating substrate.

7. The thermal convection-type accelerometer of claim 1, wherein the first insulating substrate comprises silicon nitride and silicon dioxide.

8. The thermal convection-type accelerometer of claim 1, wherein the first insulating substrate comprises polythiophene, polyethylene terephthalate or polyimide.

9. The thermal convection-type accelerometer of claim 1, wherein the first heater comprises nickel and chromium.

10. The thermal convection-type accelerometer of claim 1, further comprising an antenna directly formed on the first supporting layer.

11. The thermal convection-type accelerometer of claim 1, wherein the first temperature-sensing components comprises p-type amorphous silicon.

12. The thermal convection-type accelerometer of claim 1, further comprising a cover, wherein the cover is configured to seal the first acceleration-sensing device and the noble gas under the cover.

13. The thermal convection-type accelerometer of claim 1, wherein the first temperature-sensing components are coupled with a control and amplification device, which is a subtractor or an instrumentation amplifier.

14. The thermal convection-type accelerometer of claim 1, wherein each first temperature-sensing component comprises a plurality of thermocouples connected in series.

15. The thermal convection-type accelerometer of claim 14, wherein each thermocouple comprises a positive electrode and a negative electrode, wherein the positive electrode comprises Chromel and the negative electrode comprises Alumel.

16. The thermal convection-type accelerometer of claim 1, further comprising a cover configured to seal the first acceleration-sensing device, wherein one half of the thermocouples of each first temperature-sensing component are formed outside the cover for an ambient temperature compensator.

17. The thermal convection-type accelerometer of claim 1, further comprising two ambient temperature compensators, wherein the two ambient temperature compensators and the two first temperature-sensing components are alternatively connected in series.