Single sided, flat, no lead, integrated circuit package

• US 9,269,689 B1
• Filed: 12/21/2012
• Issued: 02/23/2016
• Est. Priority Date: 05/11/2005
• Status: Active Grant

• Current Assignee: Maxim Integrated Products, Inc. (Analog Devices, Inc.)
• Original Assignee: Maxim Integrated Products, Inc. (Analog Devices, Inc.)
• Inventors: Gordon, Jeff A., Hass, Steven, Kurkowski, Hal, Jones, Scott
• Primary Examiner(s): Karimy, Timor
• Application Number:
  US13/724,894
• Time in Patent Office: 1,159 Days
• Field of Search: 257/773, 257/E23.079, 257/E21.002, 257/726, 257/727, 438/106
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/32 Holders for supporting the complete device in operation, i.e. detachable fixtures H01L23/40 takes precedence
• CPC Class Codes: H01L 24/46 of a plurality of wire connectors
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2203/168 Wrong mounting prevention
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).

Claims

1. An integrated circuit package, comprising:

an enclosure comprising a dielectric housing, a first electrical contact, and a second electrical contact, said dielectric housing, said first electrical contact, and said second electrical contact forming a contact side of said enclosure, and said first and second electrical contacts sized to be substantially alignment insensitive to facilitate alignment tolerances for maintaining a direct bondless, and solderless, secure electro-mechanical connection to corresponding contacts of an end-use equipment when pressure is applied to the enclosure by the end-use equipment, the end-use equipment having a surface, the corresponding contacts mounted fixedly on the surface of the end-use equipment so that the corresponding contacts are flush against the surface; and

an integrated circuit die situated within said enclosure and electrically coupled to said first and second electrical contacts.

2. The integrated circuit package of claim 1, wherein said contact side of said enclosure is substantially flat.

3. The integrated circuit package of claim 1, wherein at least a portion of said integrated circuit die is disposed on an internal side of said first electrical contact.

4. The integrated circuit package of claim 3, wherein said integrated circuit die is disposed entirely on said internal side of said first electrical contact.

5. The integrated circuit package of claim 1, wherein said integrated circuit package includes only said first and second electrical contacts.

6. The integrated circuit package of claim 1, further comprising an electrical conductor situated within said enclosure, wherein said electrical conductor is attached to said integrated circuit die and to an internal side of said first electrical contact.

7. The integrated circuit package of claim 6, wherein said electrical conductor comprises a wirebond.

8. The integrated circuit package of claim 1, further comprising an electrical conductor situated within said enclosure, wherein said electrical conductor is attached to said integrated circuit die and to an internal side of said second electrical contact.

9. The integrated circuit package of claim 8, wherein said electrical conductor comprises a wirebond.

10. The integrated circuit package of claim 1, wherein said first electrical contact includes a length of at least two millimeters and a width of at least two millimeters, and wherein said second electrical contact includes a length of at least two millimeters and a width of at least two millimeters.

11. The integrated circuit package of claim 1, wherein said integrated circuit die comprises a memory device containing information related to a peripheral device hosting said integrated circuit package.

12. The integrated circuit package of claim 1, wherein said integrated circuit die comprises an authentication device for authenticating a peripheral device hosting said integrated circuit die.

13. The integrated circuit package of claim 12, wherein said authentication device is configured to authenticate the peripheral device utilizing at least one of a secure hash algorithm, a cryptographic operation, or a password entry operation.

14. The integrated circuit package of claim 1, wherein said integrated circuit die comprises a calibration device used for calibrating an end-use equipment.

15. The integrated circuit package of claim 1, wherein the end-use equipment includes a clamp device that is configured to apply pressure to the enclosure.

16. A method of forming an integrated circuit package, comprising:

forming an enclosure comprising a dielectric housing, a first electrical contact, and a second electrical contact, said dielectric housing, said first electrical contact, and said second electrical contact forming a contact side of said enclosure, and said first and second electrical contacts are sized to be substantially alignment insensitive to facilitate alignment tolerances for maintaining a direct bondless, and solderless, secure electro-mechanical connection to corresponding contacts of an end-use equipment when pressure is applied to the enclosure by the end-use equipment, the end-use equipment having a surface, the corresponding contacts mounted fixedly on the surface of the end-use equipment so that the corresponding contacts are flush against the surface; and

forming an integrated circuit die situated within said enclosure and electrically coupled to said first and second electrical contacts.

17. The method of claim 16, wherein said contact side of said enclosure is substantially flat.

18. The method of claim 16, wherein at least a portion of said integrated circuit package is disposed on an internal side of said first electrical contact.

19. The method of claim 18, wherein said integrated circuit die is disposed entirely on said internal side of said first electrical contact.

20. The method of claim 16, further comprising forming an electrical conductor situated within said enclosure, wherein said electrical conductor is attached to said integrated circuit die and to an internal side of said first electrical contact.

21. The method of claim 16, further comprising forming an electrical conductor situated within said enclosure, wherein said electrical conductor is attached to said integrated circuit die and to an internal side of said second electrical contact.

22. The method of claim 16, wherein said first electrical contact includes a length of at least two millimeters and a width of at least two millimeters, and wherein said second electrical contact includes a length of at least two millimeters and a width of at least two millimeters.