Packages with thermal management features for reduced thermal crosstalk and methods of forming same

• US 9,269,694 B2
• Filed: 12/11/2013
• Issued: 02/23/2016
• Est. Priority Date: 12/11/2013
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chen, Kim Hong, Hung, Wensen, Huang, Szu-Po, Jeng, Shin-Puu
• Primary Examiner(s): Le, Dung
• Application Number:
  US14/103,523
• Publication Number:
  US 20150162307A1
• Time in Patent Office: 804 Days
• Field of Search: 257712-723, 257/729, 257/772, 257/774, 257/787
• US Class Current: 1/1
• CPC Class Codes: H01L 2023/4056 heatsink to additional heatsink
• CPC Class Codes: H01L 2023/4062 heatsink to or through board or cabinet
• CPC Class Codes: H01L 2023/4068 Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
• CPC Class Codes: H01L 21/52 Mounting semiconductor bodies in containers
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2225/06582 Housing for the assembly, e.g. chip scale package [CSP]
• CPC Class Codes: H01L 2225/06589 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA

Abstract

An embodiment package includes a first die stack on a surface of a package component, a second die stack on the surface of the package component, and a contour lid over the first die stack and second die stack. The contour lid includes a first thermal conductive portion over the first die stack, a second thermal conductive portion over the second die stack, and a thermal barrier portion between the first thermal conductive portion and the second thermal conductive portion. The thermal barrier portion includes a low thermal conductivity material.

Claims

1. A package comprising:

a first die stack on a surface of a package component;

a second die stack on the surface of the package component;

a heat-dissipating contour lid covering the first die stack, wherein the heat-dissipating contour lid comprises an opening over the second die stack; and

a composite heat spreader comprising;

a first thermal conductive portion over the heat-dissipating contour lid and the first die stack; and

a second thermal conductive portion over the second die stack and extending into the opening, wherein the second thermal conductive portion extends beneath a top surface of the heat-dissipating contour lid.

2. The package of claim 1, further comprising, a first thermal interface material (TIM) disposed on a top surface of the first die stack, wherein the heat-dissipating contour lid is in physical contact with the first TIM.

3. The package of claim 1, further comprising:

a second thermal interface material (TIM) disposed on a top surface of the second die stack, wherein the second thermal conductive portion contacts the second TIM, and wherein the composite heat spreader further comprises a thermal barrier portion disposed between the first thermal conductive portion and the second thermal conductive portion.

4. The package of claim 3, further comprising a third TIM disposed on a top surface of the heat-dissipating contour lid, wherein the first thermal conductive portion is in physical contact with the third TIM.

5. The package of claim 3, wherein thermal barrier portion comprises a low thermal conductivity material having a thermal conductivity less than about 0.05 watts per meter kelvin, one or more air gaps, or a combination thereof.

6. The package of claim 1, wherein the composite heat spreader further comprises a cooling element.

7. The package of claim 1, further comprising a heat-dissipating contour ring surrounding the first die stack and the second die stack, wherein the heat-dissipating contour lid is over and attached to the heat-dissipating contour ring.

8. The package of claim 1, wherein the heat-dissipating contour lid comprises aluminum, copper, nickel, cobalt, or a combination thereof.

9. The package of claim 1, wherein the first die stack has a first height, and wherein the second die stack has a second height different than the first height.

10. A package comprising:

a first die stack on a surface of a package component;

a second die stack on the surface of the package component; and

a contour lid over the first die stack and second die stack, wherein the contour lid comprises;

a first thermal conductive portion over the first die stack;

a second thermal conductive portion over the second die stack; and

a first thermal barrier portion between the first thermal conductive portion and the second thermal conductive portion, wherein the first thermal barrier portion comprises a low thermal conductivity material, and wherein the low thermal conductivity material contacts a sidewall of the first thermal conductive portion and a sidewall of the second thermal conductive portion.

11. The package of claim 10, further comprising a first thermal interface material (TIM) on a top surface of the first die stack and a second TIM on a top surface of the second die stack, wherein the first thermal conductive portion is in physical contact with the first TIM, and wherein the second thermal conductive portion is in physical contact with the second TIM.

12. The package of claim 11, wherein the first TIM is physically disconnected from the second TIM.

13. The package of claim 10, wherein the first thermal barrier portion comprises an epoxy, an unsaturated polyester, a phenolic, an adhesive, or a combination thereof.

14. The package of claim 10, wherein the first thermal barrier portion further comprises one or more through holes.

15. The package of claim 10, wherein first thermal barrier portion further comprises a trench.

16. The package of claim 10, further comprising a composite heat spreader over the contour lid, wherein the composite heat spreader comprises:

a third thermal conductive portion over the first thermal conductive portion;

a fourth thermal conductive portion over the second thermal conductive portion; and

a second thermal barrier portion between the third thermal conductive portion and the fourth thermal conductive portion, wherein the second thermal barrier portion comprises a low thermal conductivity material.

17. A method comprising:

electrically connecting a first die stack to a substrate;

electrically connecting a second die stack to the substrate;

dispensing a first thermal interface material (TIM) on a top surface of the first die stack;

forming a contour lid over the first die stack, wherein the contour lid comprises;

a first thermal conductive portion physically contacting the first TIM; and

an opening adjacent to the first thermal conductive portion; and

forming a composite heat spreader comprising;

a second thermal conductive portion over the contour lid and the first die stack;

a third thermal conductive portion over the second die stack, wherein the third thermal conductive portion extend beneath a top surface of the composite heat spreader into the opening; and

a thermal barrier between the second and third thermal conductive portions.

18. The method of claim 17, wherein the contour lid further comprises a fourth thermal conductive portion physically contacting a second TIM on a top surface of a third die stack, wherein the opening is disposed between the first and fourth thermal conductive portions.

19. The method of claim 17, wherein the thermal barrier contacts a sidewall of the second thermal conductive portion and a sidewall of the third thermal conductive portion.

20. The method of claim 17, wherein the third thermal conductive portion extends beneath a bottom surface of the second thermal conductive portion.