Semiconductor device and manufacturing method the same
First Claim
1. A semiconductor device comprising:
- a gate electrode layer over a substrate;
a gate insulating layer over the gate electrode layer;
a first electrode layer over the gate insulating layer;
an oxide semiconductor layer over the gate insulating layer;
a second electrode layer over and in contact with the oxide semiconductor layer;
an insulating film over the second electrode layer;
a first wiring over the insulating film, the first wiring being electrically connected to the gate electrode layer; and
a second wiring over the insulating film, the second wiring being electrically connected to the second electrode layer,wherein the first wiring is electrically connected to the first electrode layer,wherein the second wiring overlaps the first electrode layer, andwherein the oxide semiconductor layer comprises a nanocrystal.
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Accused Products
Abstract
An object is to manufacture and provide a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which a semiconductor layer including a channel formation region serves as an oxide semiconductor film, heat treatment for reducing impurities such as moisture (heat treatment for dehydration or dehydrogenation) is performed after an oxide insulating film serving as a protective film is formed in contact with an oxide semiconductor layer. Then, the impurities such as moisture, which exist not only in a source electrode layer, in a drain electrode layer, in a gate insulating layer, and in the oxide semiconductor layer but also at interfaces between the oxide semiconductor film and upper and lower films which are in contact with the oxide semiconductor layer, are reduced.
162 Citations
19 Claims
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1. A semiconductor device comprising:
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a gate electrode layer over a substrate; a gate insulating layer over the gate electrode layer; a first electrode layer over the gate insulating layer; an oxide semiconductor layer over the gate insulating layer; a second electrode layer over and in contact with the oxide semiconductor layer; an insulating film over the second electrode layer; a first wiring over the insulating film, the first wiring being electrically connected to the gate electrode layer; and a second wiring over the insulating film, the second wiring being electrically connected to the second electrode layer, wherein the first wiring is electrically connected to the first electrode layer, wherein the second wiring overlaps the first electrode layer, and wherein the oxide semiconductor layer comprises a nanocrystal. - View Dependent Claims (2, 3, 4, 5)
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6. A semiconductor device comprising:
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a gate electrode layer over a substrate; a gate insulating layer over the gate electrode layer; a first electrode layer over the gate insulating layer; an oxide semiconductor layer over the gate insulating layer; a second electrode layer over and in contact with the oxide semiconductor layer; an insulating film over the second electrode layer; a first wiring over the insulating film, the first wiring being electrically connected to the gate electrode layer; and a second wiring over the insulating film, the second wiring being electrically connected to the second electrode layer, wherein the first wiring is electrically connected to the first electrode layer, wherein the second wiring overlaps the first electrode layer, and wherein the oxide semiconductor layer comprises a crystal having a diameter of 1 nm to 10 nm. - View Dependent Claims (7, 8, 9, 10)
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11. A semiconductor device comprising:
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a gate electrode layer over a substrate; a gate insulating layer over the gate electrode layer; a first electrode layer over the gate insulating layer; an oxide semiconductor layer over the gate insulating layer; an inorganic layer over the oxide semiconductor layer, the inorganic layer comprising oxygen; a second electrode layer over and in contact with the oxide semiconductor layer and the inorganic layer; an insulating film over the second electrode layer; a first wiring over the insulating film;
the first wiring being electrically connected to the gate electrode layer; anda second wiring over the insulating film, the second wiring being electrically connected to the second electrode layer, wherein the first wiring is electrically connected to the first electrode layer, wherein the second wiring overlaps the first electrode layer, and wherein the oxide semiconductor layer comprises a nanocrystal. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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Specification