High quality factor inductive and capacitive circuit structure
First Claim
Patent Images
1. A circuit, comprising:
- a first finger capacitor comprising a first bus line coupled to a first plurality of finger elements and a second bus line coupled to a second plurality of finger elements;
wherein the first bus line is parallel to the second bus line;
an inductor comprising a first leg oriented perpendicular to the first bus line and the second bus line;
wherein the first leg is implemented in a conductive layer above the first finger capacitor; and
a first via structure coupled between the first leg and the first bus line;
wherein the first leg of the inductor bisects the first finger capacitor and is coupled to a center of the first bus line by the first via structure; and
wherein the first via structure is disposed symmetrically about a line at the center of the first bus line that is perpendicular to the first bus line.
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Abstract
A circuit includes a first finger capacitor having a first bus line coupled to a first plurality of finger elements and a second bus line coupled to a second plurality of finger elements. The first bus line is parallel to the second bus line. The circuit further includes an inductor having a first leg oriented perpendicular to the first bus line and the second bus line. The first leg of the inductor is coupled to a center of the first bus line.
136 Citations
20 Claims
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1. A circuit, comprising:
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a first finger capacitor comprising a first bus line coupled to a first plurality of finger elements and a second bus line coupled to a second plurality of finger elements; wherein the first bus line is parallel to the second bus line; an inductor comprising a first leg oriented perpendicular to the first bus line and the second bus line; wherein the first leg is implemented in a conductive layer above the first finger capacitor; and a first via structure coupled between the first leg and the first bus line; wherein the first leg of the inductor bisects the first finger capacitor and is coupled to a center of the first bus line by the first via structure; and wherein the first via structure is disposed symmetrically about a line at the center of the first bus line that is perpendicular to the first bus line. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A circuit, comprising:
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a first plurality of finger capacitors implemented in a first plane; wherein each finger capacitor of the first plurality of finger capacitors comprises a first bus line coupled to a first plurality of finger elements and a second bus line parallel to the first bus line and coupled to a second plurality of finger elements; a second plurality of finger capacitors implemented in the first plane; wherein each finger capacitor of the second plurality of finger capacitors comprises a third bus line coupled to a third plurality of finger elements and a fourth bus line parallel to the third bus line and coupled to a fourth plurality of finger elements; wherein the third bus line is parallel to the first bus line; an inductor comprising a first leg oriented perpendicular to the first bus line and a second leg parallel to the first leg; wherein the first leg of the inductor is coupled to a center of each first bus line of the first plurality of finger capacitors; wherein the second leg of the inductor is coupled to a center of each third bus line of the second plurality of finger capacitors; wherein the first leg and the second leg are implemented within a conductive layer above the first and second plurality of finger capacitors; and wherein the first leg bisects each of the finger capacitors of the first plurality of finger capacitors and the second leg bisects each of the finger capacitors of the second plurality of finger capacitors. - View Dependent Claims (11)
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12. A method, comprising:
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providing a first finger capacitor of a circuit; wherein the first finger capacitor comprises a first bus line coupled to a first plurality of finger elements and a second bus line coupled to a second plurality of finger elements; wherein the first bus line is parallel to the second bus line; and providing an inductor comprising a first leg oriented perpendicular to the first bus line and the second bus line; wherein the first leg is implemented in a conductive layer above the first finger capacitor; and coupling a first via structure between the first leg and the first bus line; wherein the first leg of the inductor bisects the first finger capacitor and is coupled to a center of the first bus line by the first via structure; and wherein the first via structure is disposed symmetrically about a line at the center of the first bus line that is perpendicular to the first bus line. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification