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High quality factor inductive and capacitive circuit structure

  • US 9,270,247 B2
  • Filed: 11/27/2013
  • Issued: 02/23/2016
  • Est. Priority Date: 11/27/2013
  • Status: Active Grant
First Claim
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1. A circuit, comprising:

  • a first finger capacitor comprising a first bus line coupled to a first plurality of finger elements and a second bus line coupled to a second plurality of finger elements;

    wherein the first bus line is parallel to the second bus line;

    an inductor comprising a first leg oriented perpendicular to the first bus line and the second bus line;

    wherein the first leg is implemented in a conductive layer above the first finger capacitor; and

    a first via structure coupled between the first leg and the first bus line;

    wherein the first leg of the inductor bisects the first finger capacitor and is coupled to a center of the first bus line by the first via structure; and

    wherein the first via structure is disposed symmetrically about a line at the center of the first bus line that is perpendicular to the first bus line.

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