Methods for bypassing faulty connections
First Claim
1. A method of transferring data in a three-dimensional (3-D) integrated circuit device, the method comprising:
- encoding two or more data bits into a multi-bit symbol representing the two or more data bits, wherein encoding the two or more data bits comprises encoding the two or more data bits into a multi-level pulse amplitude modulation (PAM) signal, wherein the multi-level PAM signal comprises an 8-PAM signal;
transferring, for redundancy of communication, the same multi-bit symbol through two or more of a plurality of vertical connectors formed through a die of the 3-D integrated circuit device, wherein transferring the multi-bit symbol comprises transferring the 8-PAM signal via four of the plurality of vertical connectors; and
decoding the transferred multi-bit symbol into the two or more data bits.
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Accused Products
Abstract
Apparatus are disclosed, such as those involving a 3-D integrated circuit. One such apparatus includes a first die including a plurality of vertical connectors formed therethrough. The apparatus also includes a first circuit configured to encode multiple data bits into a multi-bit symbol, and provide the multi-bit symbol to two or more of the vertical connectors. The apparatus further includes a second circuit configured to receive the multi-bit symbol from at least one of the two or more vertical connectors, and decode the multi-bit symbol into the multiple data bits. The apparatus provides enhanced repairability with no or less redundant vertical connectors, thus avoiding the need for “on the fly” or field repair of defective vertical connectors.
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Citations
16 Claims
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1. A method of transferring data in a three-dimensional (3-D) integrated circuit device, the method comprising:
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encoding two or more data bits into a multi-bit symbol representing the two or more data bits, wherein encoding the two or more data bits comprises encoding the two or more data bits into a multi-level pulse amplitude modulation (PAM) signal, wherein the multi-level PAM signal comprises an 8-PAM signal; transferring, for redundancy of communication, the same multi-bit symbol through two or more of a plurality of vertical connectors formed through a die of the 3-D integrated circuit device, wherein transferring the multi-bit symbol comprises transferring the 8-PAM signal via four of the plurality of vertical connectors; and decoding the transferred multi-bit symbol into the two or more data bits. - View Dependent Claims (2, 3, 4)
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5. A method of transferring data in a three-dimensional (3-D) integrated circuit device, the method comprising:
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encoding two or more data bits into a multi-bit symbol representing the two or more data bits; transferring, for redundancy of communication, the same multi-bit symbol through two or more of a plurality of vertical connectors formed through a die of the 3-D integrated circuit device; decoding the transferred multi-bit symbol into the two or more data bits; providing the two or more data bits from a first integrated circuit on or above the die before encoding the two or more data bits; and providing the two or more data bits decoded from the multi-bit symbol to a second integrated circuit below the die after decoding the multi-bit symbol. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification