Power supply module

• US 9,271,398 B2
• Filed: 05/28/2012
• Issued: 02/23/2016
• Est. Priority Date: 02/18/2008
• Status: Active Grant

• Current Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Original Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Inventors: Chen, Da-Jung, Liu, Chun-Tiao
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US13/481,887
• Publication Number:
  US 20120262145A1
• Time in Patent Office: 1,366 Days
• Field of Search: 361/813, 361/729, 257/666, 257/676, 257/704, 257/784, 336/65, 336/200, 363/141
• US Class Current: 1/1
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10515 Stacked components
• CPC Class Codes: H05K 2201/10537 Attached components
• CPC Class Codes: H05K 2201/10924 Leads formed from a punched metal foil affixing a prefabricated self-supporting metal foil pattern H05K3/202
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

A power-supply module includes at least one power-supply component, an inductor and a package. The inductor is disposed over the at least one power-supply components, and the at least a power-supply component and the inductor are disposed within the package. Besides, the power-supply module further comprises a printed circuit board, and the at least one power-supply component and the inductor are mounted to the printed circuit board. Moreover, the inductor comprises a plurality of leads that support the inductor over the at least one power-supply component.

Claims

1. A power-supply module, comprising:

at least one power-supply component;

an inductor disposed over the at least one power-supply component, wherein the inductor has a magnetic body and a coil encapsulated in the magnetic body, wherein the magnetic body encloses the coil therein and contiguously extends into the hollow space formed by the coil, wherein the magnetic body further contiguously extends to a first lateral side of the at least one power-supply component;

a package, wherein the at least one power-supply component and the inductor are disposed within the package, wherein the package comprises epoxy resin to encapsulate the at least one power-supply component and the inductor; and

a first lead frame, wherein a first portion of the first lead frame is disposed between the at least one power-supply component and the inductor inside the package, and a second portion extending from the first portion of the first lead frame is disposed on a top or bottom surface of the package for connecting with an external circuit.

2. The power-supply module as claimed in claim 1, wherein the magnetic body further contiguously extends to a second lateral side of the at least one power-supply component.

3. The power-supply module as claimed in claim 1, wherein the at least one power-supply component comprises a plurality of electrical components that are electrically connected.

4. The power-supply module as claimed in claim 1, wherein the at least one power-supply component comprises a controller.

5. The power-supply module as claimed in claim 1, wherein the at least one power-supply component comprises a transistor.

6. The power-supply module as claimed in claim 1, wherein the at least one power-supply component comprises a resistor.

7. The power-supply module as claimed in claim 1, wherein the at least one power-supply component comprises a capacitor.

8. The power-supply module as claimed in claim 1, further comprising:

a platform, wherein the at least one power-supply component and the inductor are mounted to the platform.

9. The power-supply module as claimed in claim 1, further comprising:

a printed circuit board, wherein the at least one power-supply component and the inductor are mounted to the printed circuit board.

10. The power-supply module as claimed in claim 1, wherein the at least one power-supply component comprises a plurality of electrical components, further comprising:

a circuit substrate disposed between the plurality of electrical components and the inductor, wherein the plurality of electrical components and the inductor are electrically connected to the circuit substrate.

11. A power-supply module, comprising:

an electronic module comprising at least one power-supply component;

an inductor disposed over the electronic module, wherein the inductor has a magnetic body and a coil encapsulated in the magnetic body, wherein the magnetic body encloses the coil therein and contiguously extends into the hollow space formed by the coil, wherein the magnetic body further contiguously extends to a first lateral side of the electronic module;

a package, wherein the electronic module and the inductor are disposed within the package, wherein the package comprises epoxy resin to encapsulate the electronic module and the inductor; and

a first lead frame, wherein a first portion of the first lead frame is disposed between the electronic module and the inductor inside the package, and a second portion extending from the first portion of the first lead frame is disposed on a top or bottom surface of the package for connecting with an external circuit.

12. The power-supply module as claimed in claim 11, wherein the second portion of the lead frame extends from the first portion to said top or bottom surface of the package through a third portion of the lead frame disposed on a lateral surface of the package.

13. The power-supply module as claimed in claim 11, wherein the second portion of the lead frame extends from the first portion to said top or bottom surface of the package through a third portion of the lead frame disposed inside the package.

14. The power-supply module as claimed in claim 11, further comprising a second lead frame having a third portion disposed between the at least one power-supply component and the inductor inside the package, and a fourth portion extending from the third portion is disposed on the same surface on which the second portion of the first lead frame is disposed.