Connectors for making connections between analyte sensors and other devices

• US 9,271,670 B2
• Filed: 04/13/2015
• Issued: 03/01/2016
• Est. Priority Date: 06/17/2011
• Status: Active Grant

• Current Assignee: Abbott Diabetes Care Incorporated (Abbott Laboratories Incorporated)
• Original Assignee: Abbott Diabetes Care Incorporated (Abbott Laboratories Incorporated)
• Inventors: Moein, Mohammad E., Pace, Louis G., Hoss, Udo, Le, Phu X., Curry, Samuel M.
• Primary Examiner(s): Bui, Hung S
• Application Number:
  US14/685,304
• Publication Number:
  US 20150216455A1
• Time in Patent Office: 323 Days
• Field of Search: 361728-730, 361/748, 361/759, 361/760, 361/721, 174260-262
• US Class Current: 1/1
• CPC Class Codes: A61B 2562/164 the sensor is mounted in or on a conformable substrate or carrier
• CPC Class Codes: A61B 2562/227 Sensors with electrical connectors
• CPC Class Codes: A61B 5/14532 for measuring glucose, e.g. by tissue impedance measurement
• CPC Class Codes: A61B 5/14546 for measuring analytes not otherwise provided for, e.g. ions, cytochromes
• CPC Class Codes: A61B 5/1468 using chemical or electrochemical methods, e.g. by polarographic means A61B5/1486 takes precedence
• CPC Class Codes: A61B 5/1473 invasive, e.g. introduced into the body by a catheter A61B5/1482 takes precedence
• CPC Class Codes: A61B 5/1486 using enzyme electrodes, e.g. with immobilised oxidase
• CPC Class Codes: A61B 5/4839 combined with drug delivery
• CPC Class Codes: A61B 5/6848 Needles
• CPC Class Codes: H01L 24/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H05K 2201/053 Tails
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2201/10401 Eyelets, i.e. rings inserted into a hole through a circuit board
• CPC Class Codes: H05K 2201/10409 Screws
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: H05K 3/365 by abutting, i.e. without alloying process
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

Analyte sensor connectors that connect analyte sensors, e.g., conductive members of analyte sensors, to other devices such as sensor electronics units, e.g., sensor control units, are provided. Also provided are systems that include analyte sensors, analyte sensor connectors, and analyte sensor electronics units, as well as methods of establishing and maintaining connections between analyte sensors and analyte sensor electronics units, and methods of analyte monitoring/detection. Also provided are methods of making analyte sensor connectors and systems that include analyte sensor connectors.

Claims

1. An electrode arrangement, comprising:

a base substrate;

a first conductive layer having a width (W₁) and positioned on the base substrate;

a first dielectric layer positioned over at least a portion of the first conductive layer; and

a second conductive layer having a with (W₂) and positioned on the first dielectric layer, wherein W₁ is less than W₂ or W₂ is less than W₁.

2. The electrode arrangement of claim 1, wherein when W₁ is less than W₂ the first conductive layer is spaced away from the first and second side edges of the dielectric base substrate.

3. The electrode arrangement of claim 2, wherein the second conductive layer terminates at a distal end which is spaced back from the distal end of the first conductive layer.

4. The electrode arrangement of claim 1, wherein when W₂ is less than W₁ the second conductive layer is spaced away from the first and second side edges of the first dielectric cover layer.

5. The electrode arrangement of claim 4, wherein the second conductive layer terminates at a distal end which is spaced back from the distal end of the first conductive layer.

6. The electrode arrangement of claim 1, wherein the first and second conductive layers comprise carbon or gold.

7. The electrode arrangement of claim 1, wherein W₁ is less than W₂.

8. The electrode arrangement of claim 1, wherein W₂ is less than W₁.

9. The electrode arrangement of claim 1, wherein W₁ is less than the width of the dielectric base substrate, the width of the first dielectric cover layer and the width of the second dielectric cover layer.

10. The electrode arrangement of claim 1, wherein W₂ is less than the width of the dielectric base substrate, the width of the first dielectric cover layer and the width of the second dielectric cover layer.

11. The electrode arrangement of claim 1, further comprising a conductive strip positioned in contact with the second conductive layer and having a width that is the same as the width of the dielectric base substrate, the width of the first dielectric cover layer and the width of the second dielectric cover layer.

12. The electrode arrangement of claim 1, wherein the first conductive layer has a length (L₁) and the second conductive layer has a length (L₂).

13. The electrode arrangement of claim 11, wherein the conductive strip has a length that is less than L₁ and L₂.

14. The electrode arrangement of claim 11, wherein the conductive strip is positioned orthogonal to the second conductive layer.

15. The electrode arrangement of claim 11, wherein the conductive strip comprises a material that is different from the second conductive layer.

16. The electrode arrangement of claim 15, wherein the second conductive material comprises carbon and the conductive strip comprises Ag/AgCl.

17. The electrode arrangement of claim 1, wherein the first conductive layer comprises one or more sensing elements, the sensing elements comprising an analyte responsive enzyme and a mediator.

18. The electrode arrangement of claim 17, wherein the mediator comprises an osmium transition metal complex.

19. The electrode arrangement of claim 17, further comprising a mass transport limiting layer comprising crosslinked polymers containing heterocyclic nitrogen-containing groups.

20. The electrode arrangement of claim 19, wherein the mass transport limiting layer comprises one or more leveling agents.

21. The electrode arrangement of claim 20, wherein the leveling agent is polydimethylsiloxane.

22. The electrode arrangement of claim 1, wherein first dielectric cover has a thickness which is less than that of the base substrate.

23. The electrode arrangement of claim 22, further comprising a second dielectric layer positioned to cover at least a portion of the second conductive layer, wherein the second dielectric cover layer has a second thickness which is less than that of the dielectric base substrate.