Method and apparatus for manufacturing white light-emitting device

• US 9,272,300 B2
• Filed: 08/04/2014
• Issued: 03/01/2016
• Est. Priority Date: 01/17/2011
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Tsutsui, Tsuyoshi, Yoo, Cheol-Jun, Hong, Seong-Jae, Kim, Shin-Kun
• Primary Examiner(s): TADESSE, YEWEBDAR T
• Application Number:
  US14/451,217
• Publication Number:
  US 20140338593A1
• Time in Patent Office: 575 Days
• Field of Search: 118/504, 118/505, 118/500, 118/721, 118/301, 438/460, 438/462, 438/700, 438/745, 438/26, 438/28, 438/34, 438/465, 257/E33.059
• US Class Current: 1/1
• CPC Class Codes: B05C 1/027 only at particular parts of the articles at particular parts of work of indefinite length B05C1/16
• CPC Class Codes: H01L 21/6715 Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/50 Wavelength conversion elements

Abstract

Methods and apparatus for manufacturing a semiconductor light-emitting device that emits white light by forming a phosphor layer on an emission surface of the semiconductor light-emitting device at a wafer-level. The method includes: forming a plurality of light-emitting devices on a wafer; thinning the wafer, on which the plurality of light-emitting devices are formed; disposing the thinned wafer on a carrier film; and forming a phosphor layer on an emission surface of the plurality of light-emitting devices on the wafer.

Claims

1. An apparatus for manufacturing a light-emitting device, the apparatus comprising:

a vacuum table comprising a center portion protruding upward and peripheral portions that are stepped to be lower than the center portion;

a carrier film disposed on the vacuum table for attaching the wafer, on which a plurality of light-emitting devices are formed, on the carrier film; and

a printing mask for uniformly coating a phosphor paste on the wafer,

wherein the carrier film comprises a carrier frame formed along a circumference of the carrier film and a diameter of the protruding center portion of the vacuum table is smaller than an inner diameter of the carrier frame.

2. The apparatus of claim 1, wherein when applying a vacuum to the vacuum table, the carrier frame formed along the circumference of the carrier film is closely adhered and fixed to the peripheral portions of the vacuum table by vacuum suction pressure, and the wafer disposed on the carrier film is closely adhered and fixed to the center portion of the vacuum table.

3. The apparatus of claim 1, wherein a height of the center portion of the vacuum table is higher than a height of the carrier frame.

4. An apparatus for manufacturing a light-emitting device, the apparatus comprising:

a vacuum table comprising a center portion protruding upward and peripheral portions that are stepped to be lower than the center portion;

a carrier film disposed on the vacuum table for attaching the wafer, on which a plurality of light-emitting devices are formed, on the carrier film; and

a printing mask for uniformly coating a phosphor paste on the wafer,

wherein the printing mask comprises a mask frame formed around the circumference of the printing mask to support the printing mask, a first masking member formed to cover a region other than the wafer, and a printing region corresponding to the wafer.

5. The apparatus of claim 4, wherein the printing region comprises a plurality of openings having the same pattern as that of the plurality of light-emitting devices formed on the wafer, a second masking member formed to correspond to the scribe line formed between the light-emitting devices, and third masking members formed to correspond to electrode pads formed on the light-emitting devices.

6. The apparatus of claim 4, wherein the printing region comprises a plurality of openings having the same pattern as that of the plurality of light-emitting devices formed on the wafer and a second masking member formed to correspond to the scribe line formed between the light-emitting devices, the second masking member being extended to regions corresponding to the electrode pads formed on the light-emitting devices.

7. The apparatus of claim 4, wherein the printing region comprises one opening entirely formed in the printing region and third masking members formed to correspond to electrode pads formed on the light-emitting devices.