Solder joint for an electrical conductor and a window pane including same
First Claim
Patent Images
1. A solder joint disposed on an electrical conductor which comprises silver, said solder joint comprising:
- bismuth and tin,wherein said solder joint is formed from a first solder composition comprising bismuth and from a second solder composition comprising tin;
a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone,wherein said bismuth-rich solder bulk is disposed adjacent to said silver-solder reaction zone; and
a plurality of bismuth-rich grains formed from bismuth and substantially dispersed throughout at least said bismuth-rich solder bulk.
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Accused Products
Abstract
A solder joint is disposed on an electrical conductor which comprises silver. The solder joint comprises bismuth and tin. The solder joint has a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone. The bismuth-rich solder bulk is disposed adjacent to the silver-solder reaction zone. The solder joint comprises a plurality of bismuth-rich grains formed from bismuth and substantially dispersed throughout at least the bismuth-rich solder bulk of the solder joint. A window pane comprising the solder joint is also disclosed.
141 Citations
30 Claims
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1. A solder joint disposed on an electrical conductor which comprises silver, said solder joint comprising:
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bismuth and tin, wherein said solder joint is formed from a first solder composition comprising bismuth and from a second solder composition comprising tin; a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone, wherein said bismuth-rich solder bulk is disposed adjacent to said silver-solder reaction zone; and a plurality of bismuth-rich grains formed from bismuth and substantially dispersed throughout at least said bismuth-rich solder bulk. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A window pane comprising:
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a substrate formed from glass; an electrical conductor comprising silver and disposed across a region of said substrate; a solder joint disposed on said electrical conductor and comprising; bismuth and tin, wherein said solder joint is formed from a first solder composition comprising bismuth and from a second solder composition comprising tin, a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone, wherein said bismuth-rich solder bulk is disposed adjacent to said silver-solder reaction zone, and a plurality of bismuth-rich grains formed from bismuth and substantially dispersed throughout at least said bismuth-rich solder bulk; and an electrical connector disposed on said solder joint with said electrical connector operatively connected to and in electrical communication with said electrical conductor through said solder joint. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. An electrical device comprising:
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a first electrical conductor comprising silver; a solder joint disposed on said first electrical conductor and comprising; bismuth and tin, wherein said solder joint is formed from a first solder composition comprising bismuth and from a second solder composition comprising tin, a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone, wherein said bismuth-rich solder bulk is disposed adjacent to said silver-solder reaction zone, and a plurality of bismuth-rich grains formed from bismuth and substantially dispersed throughout at least said bismuth-rich solder bulk; and a second electrical conductor disposed on said solder joint with said second electrical conductor operatively connected to and in electrical communication with said first electrical conductor through said solder joint. - View Dependent Claims (28, 29, 30)
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Specification