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Gas treatment systems

  • US 9,273,395 B2
  • Filed: 11/22/2010
  • Issued: 03/01/2016
  • Est. Priority Date: 01/12/2007
  • Status: Active Grant
First Claim
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1. A method of treating one or more substrates comprising:

  • (a) rotating a holder carrying the substrates about an axis while maintaining surfaces of the substrates substantially perpendicular to the axis and facing in an upstream direction along the axis; and

    , during the rotating step,(b) discharging a first gas in the downstream direction toward the substrates as a first gas stream extending across the axis in a first radial direction perpendicular to the axis and as a second gas stream extending perpendicular to the axis in a second radial direction perpendicular to the first radial direction;

    (c) simultaneously discharging a second gas in the downstream direction toward the substrates as third gas streams disposed around the axis between the first and second gas streams; and

    (d) discharging the second gas in the downstream direction toward the substrates from a center inlet disposed substantially on the axis.

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