Photonic integration platform
First Claim
Patent Images
1. A method comprising:
- forming a first waveguide in an insulation layer of an optical device, wherein the first waveguide comprises a waveguide adapter in the insulation layer, the waveguide adapter comprising multiple prongs exposed at an external coupling surface of the optical device, the external coupling surface is configured to couple to an external light source;
after forming the first waveguide, disposing a crystalline semiconductor layer on the insulation layer; and
forming a second waveguide in the semiconductor layer, wherein the second waveguide at least partially overlaps the first waveguide in the insulation layer.
1 Assignment
0 Petitions
Accused Products
Abstract
A SOI device may include a waveguide adapter that couples light between an external light source—e.g., a fiber optic cable or laser—and a silicon waveguide on the silicon surface layer of the SOI device. In one embodiment, the waveguide adapter is embedded into the insulator layer. Doing so may enable the waveguide adapter to be formed before the surface layer components are added onto the SOI device. Accordingly, fabrication techniques that use high-temperatures may be used without harming other components in the SOI device—e.g., the waveguide adapter is formed before heat-sensitive components are added to the silicon surface layer.
32 Citations
7 Claims
-
1. A method comprising:
-
forming a first waveguide in an insulation layer of an optical device, wherein the first waveguide comprises a waveguide adapter in the insulation layer, the waveguide adapter comprising multiple prongs exposed at an external coupling surface of the optical device, the external coupling surface is configured to couple to an external light source; after forming the first waveguide, disposing a crystalline semiconductor layer on the insulation layer; and forming a second waveguide in the semiconductor layer, wherein the second waveguide at least partially overlaps the first waveguide in the insulation layer. - View Dependent Claims (2, 3, 4, 5)
-
-
6. A method comprising:
-
forming a first waveguide in an insulation layer of an optical device; after forming the first waveguide, disposing a crystalline semiconductor layer on the insulation layer; and forming a second waveguide in the semiconductor layer, wherein the second waveguide at least partially overlaps the first waveguide in the insulation layer, wherein at least a portion of the first waveguide and a portion of the second waveguide are tapered where the first and second waveguides overlap in the optical device.
-
-
7. A method comprising:
-
forming a first waveguide in an insulation layer of an optical device, wherein the insulation layer completely surrounds the first waveguide; after forming the first waveguide, disposing a crystalline semiconductor layer on the insulation layer; and forming a second waveguide in the semiconductor layer, wherein the second waveguide at least partially overlaps the first waveguide in the insulation layer.
-
Specification