Information carrying card comprising a cross-linked polymer composition, and method of making the same

• US 9,275,321 B2
• Filed: 10/10/2012
• Issued: 03/01/2016
• Est. Priority Date: 04/03/2012
• Status: Active Grant

• Current Assignee: X-Card Holdings LLC
• Original Assignee: X-Card Holdings LLC
• Inventors: Cox, Mark A.
• Primary Examiner(s): Leonard, Michael L
• Application Number:
  US13/648,805
• Publication Number:
  US 20130261262A1
• Time in Patent Office: 1,238 Days
• Field of Search: 525/455, 525/125, 525/126, 525/129
• US Class Current: 1/1
• CPC Class Codes: B32B 2250/40 Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
• CPC Class Codes: B32B 2255/26 Polymeric coating
• CPC Class Codes: B32B 2264/02 Synthetic macromolecular particles
• CPC Class Codes: B32B 2307/748 Releasability
• CPC Class Codes: B32B 2307/75 Printability
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/20 using fillers, pigments, thixotroping agents
• CPC Class Codes: B32B 27/205 the fillers creating voids or cavities, e.g. by stretching
• CPC Class Codes: B32B 3/08 characterised by added members at particular parts layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18
• CPC Class Codes: B32B 3/18 characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side B32B5/02 takes precedence
• CPC Class Codes: B32B 3/26 characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids foam layer B32B5/18; layer of synthetic resin characterised by fillers that create voids or cavities B32B27/205; characterised by an apertured layer
• CPC Class Codes: B32B 3/30 characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs apertured layer B32B3/266; layer with cavities or internal voids B32B3/26
• CPC Class Codes: B32B 37/06 characterised by the heating method
• CPC Class Codes: B32B 37/08 characterised by the cooling method
• CPC Class Codes: B32B 37/10 characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
• CPC Class Codes: C08L 2203/206 use in coating or encapsulating of electronic parts
• CPC Class Codes: C08L 27/06 Homopolymers or copolymers of vinyl chloride
• CPC Class Codes: C08L 33/14 : of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
• CPC Class Codes: C08L 63/10 : Epoxy resins modified by unsaturated compounds
• CPC Class Codes: C08L 75/04 : Polyurethanes
• CPC Class Codes: C08L 75/06 : from polyesters
• CPC Class Codes: C08L 75/14 : Polyurethanes having carbon-to-carbon unsaturated bonds
• CPC Class Codes: C08L 75/16 : having terminal carbon-to-carbon unsaturated bonds
• CPC Class Codes: G06K 19/07722 : the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07745 : Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0313 : Organic insulating material
• CPC Class Codes: H05K 1/0353 : consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
• CPC Class Codes: H05K 1/16 : incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/183 : Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/09036 : Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/10037 : Printed or non-printed battery
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 428/24612 : Composite web or sheet
• CPC Class Codes: Y10T 428/31511 : Of epoxy ether
• CPC Class Codes: Y10T 428/31529 : Next to metal
• CPC Class Codes: Y10T 428/31598 : Next to silicon-containing [silicone, cement, etc.] layer
• CPC Class Codes: Y10T 428/31605 : Next to free metal
• CPC Class Codes: Y10T 428/31663 : As siloxane, silicone or silane
• CPC Class Codes: Y10T 428/31667 : Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product
• CPC Class Codes: Y10T 428/31692 : Next to addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31699 : Ester, halide or nitrile of addition polymer

Abstract

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof.

Claims

1. A crosslinkable polymer composition comprising:

a curable base polymer in a liquid or paste form, the base polymer comprising urethane acrylate;

a particulate thermoplastic filler comprising polyvinyl chloride (PVC) or PVC modified with a copolymer of vinyl chloride and at least another monomer, wherein at least another monomer is selected from the group consisting of vinyl ester, vinyl acetate and vinyl ether;

and a photoinitiator for UV or visible light curing.

2. The crosslinkable polymer composition of claim 1, further comprising a curative for thermal curing.

3. The crosslinkable polymer composition of claim 1 comprising in the range of from about 0.5 wt. % to about 80 wt. % of the particulate thermoplastic filler.

4. The crosslinkable polymer composition of claim 1 comprising in the range of from about 5 wt. % to about 50 wt. % of the particulate thermoplastic filler.

5. The crosslinkable polymer composition of claim 1 comprising in the range of from about 0.5 wt. % to about 35 wt. % of the particulate thermoplastic filler.

6. The crosslinkable polymer composition of claim 1 comprising in the range of from about 5 wt. % to about 20 wt. % of the particulate thermoplastic filler.

7. The crosslinkable polymer composition of claim 1 wherein the curable base polymer comprises an oligomer or pre-polymer.

8. The crosslinkable polymer composition of claim 1 wherein the particulate thermoplastic filler has a particle size in the range of from 1 nanometer (nm) to 1000 nanometers.

9. The crosslinkable polymer composition of claim 1 wherein the ratio of PVC and the copolymer of vinyl chloride and at least another monomer in the particulate thermoplastic filler is in the range of from 95:

5 to 80;

20 by weight.

10. The crosslinkable polymer composition of claim 1 wherein the crosslinkable polymer composition is suitable for use for forming a core layer of an information carrying card, and can be dispensed into a cavity defined by a thermoplastic layer.