Removable indicator structure in electronic chips of a common substrate for process adjustment
First Claim
1. A method of processing a plurality of packaged electronic chips being connected to one another in a common substrate, the method comprising:
- etching the electronic chips;
detecting information indicative of an at least partial removal of an indicator structure following an exposure of the indicator structure embedded within at least a part of the electronic chips and being exposed after the etching has removed chip material above the indicator structure; and
adjusting the processing upon detecting the information indicative of the at least partial removal of the indicator structure.
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Accused Products
Abstract
A method of processing a plurality of packaged electronic chips being connected to one another in a common substrate is provided, wherein the method comprises etching the electronic chips, detecting information indicative of an at least partial removal of an indicator structure following an exposure of the indicator structure embedded within at least a part of the electronic chips and being exposed after the etching has removed chip material above the indicator structure, and adjusting the processing upon detecting the information indicative of the at least partial removal of the indicator structure.
26 Citations
14 Claims
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1. A method of processing a plurality of packaged electronic chips being connected to one another in a common substrate, the method comprising:
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etching the electronic chips; detecting information indicative of an at least partial removal of an indicator structure following an exposure of the indicator structure embedded within at least a part of the electronic chips and being exposed after the etching has removed chip material above the indicator structure; and adjusting the processing upon detecting the information indicative of the at least partial removal of the indicator structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of processing a plurality of electronic chips being connected to one another by a common substrate, the method comprising:
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plasma etching the electronic chips simultaneously; detecting volatile matter in an environment of the plasma-etched electronic chips to thereby derive information indicative of an exposure and an at least partial removal of an indicator layer embedded within the electronic chips and being exposed after the etching has removed chip material above the indicator layer, wherein the volatile matter is impacted by the exposure of the indicator layer; and adjusting the plasma etching upon detecting the exposure of the indicator layer. - View Dependent Claims (14)
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Specification