Semiconductor device
First Claim
Patent Images
1. A semiconductor device comprising:
- a first lead frame;
a second lead frame provided to be separated from the first lead frame;
a semiconductor chip provided on the first lead frame, the semiconductor chip having a first surface and a second surface opposite the first surface, the first surface bonded to the first lead frame;
a resin sealing the semiconductor chip; and
a connector having;
a first portion provided on the second surface of the semiconductor chip and bonded to a second electrode, the first portion having a first bonding surface bonded to the second electrode of the semiconductor chip, and a third surface opposite the first bonding surface and exposed from the resin; and
a second portion protruding from the first portion toward the second lead frame side and thinner than the first portion, the second portion having a second bonding surface bonded to the second lead frame, a lower surface provided between the first bonding surface and the second bonding surface, and a level difference portion provided between the second bonding surface and the lower surface, the second bonding surface provided on the second lead frame, the lower surface provided on the first lead frame, the second bonding surface being coplanar with a part of the lower surface.
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Accused Products
Abstract
According to one embodiment, the connector has a first portion and a second portion. The first portion is provided on the second surface of the semiconductor chip and bonded to the second electrode. The first portion has a first bonding surface bonded to the second electrode of the semiconductor chip, and a heat dissipation surface opposite the first bonding surface and exposed from the resin. The second portion protrudes from the first portion toward the second lead frame side and thinner than the first portion. The second portion has a second bonding surface bonded to the second lead frame and a level difference portion provided near the second bonding surface at the first portion side.
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Citations
20 Claims
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1. A semiconductor device comprising:
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a first lead frame; a second lead frame provided to be separated from the first lead frame; a semiconductor chip provided on the first lead frame, the semiconductor chip having a first surface and a second surface opposite the first surface, the first surface bonded to the first lead frame; a resin sealing the semiconductor chip; and a connector having; a first portion provided on the second surface of the semiconductor chip and bonded to a second electrode, the first portion having a first bonding surface bonded to the second electrode of the semiconductor chip, and a third surface opposite the first bonding surface and exposed from the resin; and a second portion protruding from the first portion toward the second lead frame side and thinner than the first portion, the second portion having a second bonding surface bonded to the second lead frame, a lower surface provided between the first bonding surface and the second bonding surface, and a level difference portion provided between the second bonding surface and the lower surface, the second bonding surface provided on the second lead frame, the lower surface provided on the first lead frame, the second bonding surface being coplanar with a part of the lower surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor device comprising:
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a first lead frame; a second lead frame provided to be separated from the first lead frame; a semiconductor chip provided on the first lead frame, the semiconductor chip including a semiconductor layer, a first electrode, and a second electrode, the semiconductor layer having a first surface and a second surface opposite the first surface, the first electrode being provided on the first surface and bonded to the first lead frame, the second electrode being provided on the second surface; a resin sealing the semiconductor chip; and a connector having; a first portion provided on the second surface of the semiconductor chip and bonded to the second electrode, the first portion having a first bonding surface bonded to the second electrode of the semiconductor chip, and a third surface opposite the first bonding surface and exposed from the resin; and a second portion protruding from the first portion toward the second lead frame side and thinner than the first portion, the second portion having a second bonding surface bonded to the second lead frame, a first recess or a first protrusion provided at the second bonding surface of the connector, a second protrusion engaging with the first recess or a second recess engaging with the first protrusion provided at an upper surface of the second lead frame bonded to the second bonding surface. - View Dependent Claims (11, 12, 13, 14)
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15. A semiconductor device comprising:
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a first lead frame; a second lead frame provided to be separated from the first lead frame; a semiconductor chip provided on the first lead frame, the semiconductor chip including a semiconductor layer, a first electrode, and a second electrode, the semiconductor layer having a first surface and a second surface opposite the first surface, the first electrode being provided on the first surface and bonded to the first lead frame, the second electrode being provided on the second surface; an insulating film provided on the second surface and having an opening exposing the second electrode; a resin sealing the semiconductor chip; and a connector having; a first portion provided on the second surface of the semiconductor chip and bonded to the second electrode, the first portion having a first bonding surface bonded to the second electrode of the semiconductor chip, and a third surface opposite the first bonding surface and exposed from the resin; and a second portion protruding from the first portion to the second lead frame side and thinner than the first portion, the second portion having a second bonding surface bonded to the second lead frame, an edge of the first bonding surface of the first portion of the connector being located on an inside of an edge of the opening of the insulating film at a distance of not less than 50 μ
m and not more than 200 μ
m. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification